US 10,843,284 B2Granted

Method for void reduction in solder joints

AssigneeZKW Group GmbH

InventorErik Edlinger

Life of this patent

Estimating the term…

Loading patent…

Abstract

The invention relates to a process to connect, by soldering, at least one electronic component (104, 204, 304, 404, 504) with a mounting plate (100, 200, 300, 400, 500), the mounting plate having at least one mounting plate contact surface (102, 202, 302, 402, 502) and the at least one electronic component having at least one component contact surface (105) corresponding to it, the at least one mounting plate contact surface being surrounded by a solder resist layer (101, 201, 301, 401, 501) that borders the at least one mounting plate contact surface, the process having the following steps: a) Applying solder paste (106, 206, 306, 406, 506) onto at least areas of the solder resist layer (101, 201, 301, 401, 501), minimally overlapping with the mounting plate contact surface (102, 202, 302, 402, 502) adjacent to the solder resist layer, b) Equipping the mounting plate with the at least one electronic component (104, 204, 304, 404, 504), the at least one component contact surface (105) at least partly covering the at least one mounting plate contact surface (102, 202, 302, 402, 502) corresponding to it; and c) Heating the solder paste (106, 206, 306, 406, 506) to produce a soldered connection between the mounting plate and the at least one component.

Claims20

Dependent claims

A process to connect, by soldering, at least one electronic component (304) to a quadrilateral mounting plate (300), the mounting plate having at least one mounting plate contact surface (302), and the at least one electronic component having at least one component contact surface corresponding to the at least one mounting plate contact surface, the at least one mounting plate contact surface being surrounded by a solder resist layer (301) that borders the at least one mounting plate contact surface, the process comprising:

applying solder paste (306) onto an area of the solder resist layer (301) that is bordering a long side or a transverse side of the at least one mounting plate contact surface (302) so that the solder paste overlaps onto the bordering long side or transverse side, creating an overlap having a minimum and maximum overlap;
mounting the at least one electronic component (304) onto the mounting plate, the at least one component contact surface at least partly covering the corresponding at least one mounting plate contact surface (302);
and
heating the solder paste (306) to produce a soldered connection between the mounting plate and the at least one electronic component,
wherein, if the solder paste overlaps the long side of the at least one mounting plate contact surface, (i) a long-side depth of the minimum overlap of the solder paste with the at least one mounting plate contact surface along the long side lies in a range of about 0.2-0.5 mm at a first terminal end of the long side and (ii) starting from the minimum overlap, the long-side depth of the overlap of the solder paste with the at least one mounting plate contact surface increases in length from the minimum overlap to reach the maximum overlap at a second terminal end of the long side;
and
wherein, if the solder paste overlaps the transverse side of the at least one mounting plate contact surface, (i) a transverse-side depth of the minimum overlap of the solder paste with the at least one mounting plate contact surface along the transverse side lies in a range of about 0.3-0.7 mm at a first terminal end of the transverse side and (ii) starting from the minimum overlap, the transverse-side depth of the overlap of the solder paste with the at least one mounting plate contact surface increases in length from the minimum overlap to reach the maximum overlap at a second terminal end of the transverse side.

4 more elements

A process to connect, by soldering, at least one electronic component to a square mounting plate, the mounting plate having at least one mounting plate contact surface, and the at least one electronic component having at least one component contact surface corresponding to the at least one mounting plate contact surface, the at least one mounting plate contact surface being surrounded by a solder resist layer that borders the at least one mounting plate contact surface, the process comprising:

applying solder paste onto an area of the solder resist layer that is bordering a side of the at least one mounting plate contact surface, so that the solder paste overlaps onto the bordering side, creating an overlap having a minimum and maximum overlap;
mounting the at least one electronic component onto the mounting plate, the at least one component contact surface at least partly covering the corresponding at least one mounting plate contact surface;
and
heating the solder paste to produce a soldered connection between the mounting plate and the at least one electronic component;
wherein a depth of the minimum overlap of the solder paste with the at least one mounting plate contact surface along the side of the at least one mounting plate contact surface lies in a range of about 0.2-0.5 mm at a first terminal end of the side;
and
wherein, starting from the minimum overlap, the depth of the overlap of the solder paste with the at least one mounting plate contact surface increases in length from the minimum overlap to reach the maximum overlap at a second terminal end of the side.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/536,377Filed 18 Nov 2015
Priority: AT A 50924/201418 Dec 2014
Published: US 2018/0093338 A15 Apr 2018
Granted: 24 Nov 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification19 codes

B23K 1/0016
Specially adapted for particular articles or work: soldering of electronic components
B23K 1/008
Soldering, e.g. brazing, or unsoldering: soldering within a furnace
B23K 1/203
Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating: fluxing, i.e. applying flux onto surfaces
H05K 3/3452
By soldering: solder masks