Device for soldering electrical or electronic components

A device for soldering electrical or electronic components on a printed circuit board, said device comprising:

• a solder crucible adapted to contain liquid solder, the liquid solder having a liquid solder surface level;
• at least one carrier including a carrier plate disposed above said solder crucible;
• a plurality of soldering nozzles extending upwardly from said carrier plate, wherein molten solder is conveyed out of the solder crucible and through a tip of each of the soldering nozzles to components to be soldered, said tips being at an upper end of said plurality of soldering nozzles;
• and
• a discharge unit for excess solder discharged by the plurality of soldering nozzles said discharge unit being arranged between said tips of said soldering nozzles and the carrier plate, wherein the discharge unit includes at least one substantially horizontal baffle plate surrounding the plurality of soldering nozzles, and the baffle plate includes a single drain opening for solder and a multitude of recesses through which the plurality of soldering nozzles extend, the entire baffle plate being spaced below said tips of said plurality of soldering nozzles and above said carrier plate, where the spacing distance of the baffle plate above the carrier plate or above the liquid solder surface level is selected to prevent spatter from being formed when the solder hits the carrier plate.