Circuit board to be precoated with solder layers and solder circuit board
AssigneesFurukawa Electric Co., Ltd., Harima Chemicals, Inc.
InventorsToshiaki Amano, Kazuhito Hikasa, Seishi Kumamoto, Takahiro Fujiwara
Life of this patent
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Abstract
A large number of pads, to which component leads are to be soldered, are formed on an insulating substrate so as to constitute a pad array. Colder layers are precoated on the pads. Each of the pads has a component lead mounting portion where a component lead is to be mounted, and a component lead non-mounting portion where no component lead is to be mounted. The component lead non-mounting portion includes a wide part having a width greater than that of the component lead mounting portion.
Claims14
A circuit board to be precoated with solder layers, comprising:
- a substrate;
- and
- an array of conductive members formed on said substrate and on which solder layers are to be precoated for soldering component leads to said conductive members;
- wherein each of said conductive members has a component lead mounting portion where a component lead is to be mounted, a component lead non-mounting portion where no component lead is to be mounted and which is continuous with said component lead mounting portion, and another component lead non-mounting portion located opposite to said component lead non-mounting portion;
- said component lead non-mounting portion includes a wide part having a width greater than that of said component lead mounting portion and said another component lead non-mounting portion includes a narrow part having a width less than that of said component lead mounting portion;
- and
- said conductive members are arranged with a wide part of each conductive member and a narrow part of an adjacent conductive member, being located side by side.
A solder precoated circuit board comprising:
- a substrate;
- an array of conductive members formed on said substrate and to which component leads are to be soldered;
- and
- a solder layer precoated on said conductive members;
- wherein each of said conductive members has a component lead mounting portion where a component lead is to be mounted, a component lead non-mounting portion where no component lead is to be mounted and which is continuous with said component lead mounting portion, and another component lead non-mounting portion located opposite to said component lead non-mounting portion;
- said component lead non-mounting portion includes a wide part having a width greater than that of said component lead mounting portion and said another component lead non-mounting portion includes a narrow part having a width less then that of said component lead mounting portion;
- and
- said conductive members are arranged with a wide part of each conductive member and a narrow part of each conductive member being located side by side.
A circuit board comprising:
- a substrate;
- and
- an array of conductive members formed on said substrate such that a wide part of each said conductive member and a narrow part of an adjacent said conductive member are arranged to be located side by side;
- each of said conductive members having:
- (a) a component lead mounting portion having a first width where a component lead is mounted;
- (b) a first component lead non-mounting portion having a wide part of a second width where said component lead is not mounted, said first component lead non-mounting portion is continuous with said component lead mounting portion;
- and
- (c) a second component lead non-mounting portion having a wide part of a third width where said component lead is not mounted, said second component lead non-mounting portion located opposite to said first component lead non-mounting portion;
- such that said first width is narrower than said second width and said first width is narrower than said third width.
Dependencies are inferred from the claim text.