H05K 2203/049
Wire bonding
H05K2203/049 (Wire bonding) appears on 637 US grants and 699 published applications in this corpus.
Search patents in H05K- Granted patents
- 637
- Published applications
- 699
- Assignees
- 363
- Inventors
- 1,625
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 7 | 0 |
| 1990 | 0 | 0 |
| 1991 | 5 | 0 |
| 1992 | 7 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 7 | 0 |
| 1997 | 3 | 0 |
| 1998 | 15 | 0 |
| 1999 | 4 | 0 |
| 2000 | 11 | 0 |
| 2001 | 8 | 8 |
| 2002 | 24 | 21 |
| 2003 | 14 | 19 |
| 2004 | 20 | 17 |
| 2005 | 13 | 37 |
| 2006 | 22 | 27 |
| 2007 | 16 | 37 |
| 2008 | 13 | 52 |
| 2009 | 15 | 38 |
| 2010 | 31 | 45 |
| 2011 | 37 | 31 |
| 2012 | 28 | 23 |
| 2013 | 32 | 21 |
| 2014 | 23 | 26 |
| 2015 | 16 | 32 |
| 2016 | 25 | 28 |
| 2017 | 26 | 38 |
| 2018 | 29 | 20 |
| 2019 | 24 | 28 |
| 2020 | 30 | 29 |
| 2021 | 23 | 22 |
| 2022 | 19 | 34 |
| 2023 | 16 | 20 |
| 2024 | 23 | 24 |
| 2025 | 14 | 13 |
| 2026 | 11 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board assembly and method of manufacturing the same, packaging structure having the same1 Sep 2026US 12,727,091 B2Avary Holding (Shenzhen) Co., Limited.
- Optical module11 Aug 2026US 12,706,429 B2Hisense Broadband Multimedia Technologies Co., Ltd.
- Circuit board and manufacturing method thereof4 Aug 2026US 12,701,654 B2Samsung Electro-Mechanics Co., Ltd.
- Wire bonding machine having a rotatable capillary to secure a bond wire to a connection point19 May 2026US 12,635,080 B2SanDisk Technologies LLC
- Integrated circuit optical package comprising a flexible electrical connection element12 May 2026US 12,628,272 B2STMicroelectronics (Grenoble 2) SAS
- Component isolation during plasma exposure6 Aug 2026US 2026/0231340 A1Skyworks Solutions, Inc.
- Lighting module with top contact and surface mount leds23 Jul 2026US 2026/0210522 A1Lumileds LLC
- Circuit substrate having improved bonding structure18 Jun 2026US 2026/0173266 A1Tong Hsing Electronic Industries, Ltd.
- Camera module4 Jun 2026US 2026/0156340 A1LG Innotek Co., Ltd.
- Electrical device, method for producing an electrical device7 May 2026US 2026/0130269 A1Schaeffler Technologies AG & Co. KG
Most cited
By later US patents
- Multichip module for surface mounting on printed circuit boards281US 6,154,372 ASiemens Aktiengesellschaft · 2000
- Microelectronic connector with planar elastomer sockets188US 6,133,072 ATessera, Inc. · 2000
- Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom168US 4,729,061 AAdvanced Micro Devices, Inc. · 1988
- Flip chip adaptor package for bare die158US 6,265,766 B1Micron Technology, Inc. · 2001
- Method for fabricating semiconductor components with through wire interconnects153US 7,371,676 B2Micron Technology, Inc. · 2008