Wire bonding machine having a rotatable capillary to secure a bond wire to a connection point
AssigneeSanDisk Technologies LLC
InventorsJingyun Chen, Fen Yu, Guangqiang Li, Pengchen Ai, Fuqiang Xiao, Shujun Zheng, Yuan Ming, Sizhe Yue, Lian Chen
Life of this patent
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Abstract
A wire bonder has a rotatable capillary for forming a stitch bond on a bonding surface of a connection point. When the stitch bond is formed, a bond head of the wire bonder causes the capillary to rotate in a XY plane. Rotation of the capillary causes at least a portion of the stitch bond to contact one or more side walls of the connection point. As a result, an entire surface area of the stitch bond contacts one or more surfaces of the connection point.
Claims20
A wire bonder, comprising:
- a controller executing one or more instructions and causing:
- a bond head to move a capillary from a first position to a second position that is lower than the first position when forming a bond on a first surface of a connection point;
- and
- a rotation mechanism to rotate at least one of the bond head and the capillary about an axis when the capillary is in the second position, the rotation of the at least one of the bond head and the capillary securing at least a portion of the bond to a second surface of the connection point.
A method of forming a bond on a connection point of a printed circuit board (PCB), comprising:
- causing, in response to a first instruction executed by a controller of a wire bonding machine, a bond head of the wire bonding machine to move a capillary of the wire bonding machine from a first position to a second position that is below the first position;
- forming a first portion of a bond on a first surface of the connection point of the PCB when the capillary is in the second position;
- and
- causing, in response to a second instruction executed by the controller of the wire bonding machine, a rotation mechanism of the wire bonding machine to rotate the capillary about an axis to form a second portion of the bond on a second surface of the connection point.
A wire bonding means, comprising:
- a bond wire dispensing means;
- and
- a control means that executes one or more instructions, the execution of which:
- causes movement of the bond wire dispensing means from a first position to a second position that is lower than the first position to form a bond on a first surface of a connection means;
- and
- causes a rotation means to rotate the bond wire dispensing means in a XY plane when the bond wire dispensing means is in the second position, wherein the rotation of the bond wire dispensing means in the XY plane secures at least a portion of the bond to a second surface of the connection means.
Dependencies are inferred from the claim text.