Integrated circuit optical package comprising a flexible electrical connection element

An integrated-circuit package, comprising:

• a first multilayer support substrate;
• a second multilayer support substrate;
• a flexible electrical-connection element sandwiched between a first face of the first multilayer support substrate and a second face of the second multilayer support substrate;
• wherein the flexible electrical-connection element includes a first orifice;
• wherein the first multilayer support includes a second orifice;
• wherein the first and second orifices face each other and together define a cavity;
• a component located in said cavity;
• wherein a first part of the second multilayer support substrate extends at least partially over the cavity and includes a first metal pillar at the second face of the second multilayer support substrate that is electrically connected to the component;
• wherein a second part of the second multilayer support substrate includes a second metal pillar at the second face of the second multilayer support substrate that is electrically connected to the flexible electrical-connection element;
• and
• wherein the second multilayer support substrate further includes an electrically conductive layer electrically connecting between the first and second metal pillars.