Circuit board assembly and method of manufacturing the same, packaging structure having the same

A packaging structure comprising:

• a circuit board assembly comprising:
• a circuit substrate comprising a base layer, a wiring layer formed on the base layer, and a conductive casing formed on the wiring layer, the conductive casing defining a cavity for exposing the wiring layer;
• an electronic component mounted in the cavity, the electronic component electrically connected to the exposed wiring layer;
• a heat conductive medium filled in the cavity, the electronic component immersed in the heat conductive medium;
• and
• a conductive cover formed on the conductive casing, the conductive cover enclosing the conductive casing;
• and
• a packaging board formed on the circuit board assembly, the packaging board comprising an insulator and an inner wiring layer arranged in the insulator, the packaging board defining a slot for partially exposing the inner wiring layer, the conductive casing received in the slot and connected to the exposed inner wiring layer.