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US 2026/0156340 A1Published application
Camera module
AssigneeLG Innotek Co., Ltd.
InventorsWon Seob SHIN, Tae Young KIM
Life of this patent
Estimating the term…
Abstract
A camera module according to an embodiment includes a circuit board including a cavity; a reinforcing plate including a first region corresponding to the cavity and a second region in which the circuit board is disposed; a wire part disposed in the first region of the reinforcing plate; and an image sensor disposed on the wire part, wherein a lower surface of the image sensor is in direct contact with the wire part, and wherein the wire part and the image sensor are electrically separated from each other.
Claims20
A camera module comprising:
- a metal plate including a metal material;
- a circuit board disposed on the metal plate and including a cavity;
- a wire part disposed on the metal plate and within the cavity;
- a first adhesive member disposed on the metal plate and within the cavity;
- an image sensor disposed on the wire part and the first adhesive member and having a lower surface in direct contact with the wire part;
- and
- a connection wire configured to electrically connect the circuit board and the image sensor.
4 more elements
An optical device comprising:
- a main body;
- a camera module disposed in the main body;
- and
- a display unit disposed on the main body and configured to output an image photographed by the camera module,
- wherein the camera module includes:
- a metal plate including a metal material;
- a circuit board disposed on the metal plate and including a cavity;
- a wire part disposed on the metal plate and within the cavity;
- a first adhesive member disposed on the metal plate and within the cavity;
- an image sensor disposed on the wire part and the first adhesive member and having a lower surface in direct contact with the wire part;
- and
- a connection wire configured to electrically connect the circuit board and the image sensor.
9 more elements
Dependencies are inferred from the claim text.