H05K 2203/044
Solder dip coating, i.e. coating printed conductors
Official title: Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
H05K2203/044 (Solder dip coating, i.e. coating printed conductors) appears on 163 US grants and 99 published applications in this corpus.
Search patents in H05K- Granted patents
- 163
- Published applications
- 99
- Assignees
- 125
- Inventors
- 315
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 7 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 8 | 0 |
| 1990 | 1 | 0 |
| 1991 | 5 | 0 |
| 1992 | 4 | 0 |
| 1993 | 7 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 7 | 0 |
| 1997 | 5 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 4 | 3 |
| 2003 | 1 | 3 |
| 2004 | 2 | 3 |
| 2005 | 2 | 2 |
| 2006 | 1 | 2 |
| 2007 | 4 | 5 |
| 2008 | 1 | 1 |
| 2009 | 3 | 1 |
| 2010 | 2 | 1 |
| 2011 | 1 | 2 |
| 2012 | 2 | 3 |
| 2013 | 4 | 6 |
| 2014 | 1 | 10 |
| 2015 | 8 | 8 |
| 2016 | 6 | 6 |
| 2017 | 3 | 1 |
| 2018 | 5 | 9 |
| 2019 | 4 | 2 |
| 2020 | 7 | 12 |
| 2021 | 3 | 3 |
| 2022 | 5 | 5 |
| 2023 | 4 | 5 |
| 2024 | 1 | 0 |
| 2025 | 3 | 4 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Soldering system and method of use31 Mar 2026US 12,589,445 B2Illinois Tool Works Inc.
- Soldering apparatus7 Oct 2025US 12,434,316 B2Senju Metal Industry Co., Ltd.
- Coating device and component mounting machine25 Mar 2025US 12,262,480 B2Fuji Corporation
- On-demand method of making PCB pallets using additive manufacturing25 Feb 2025US 12,238,868 B2Jabil Inc.
- On-demand method of making PCB pallets using additive manufacturing16 Jul 2024US 12,041,723 B2Jabil Inc.
- Electronic Device and System With an Improved Cooling Concept23 Apr 2026US 2026/0113834 A1Bayerische Motoren Werke Aktiengesellschaft
- Universal Surface-Mount Semiconductor Package12 Mar 2026US 2026/0076242 A1Adventive International Ltd.
- Method of processing substrate using jet soldering apparatus14 Aug 2025US 2025/0256342 A1Senju Metal Industry Co., Ltd.
- Metal-ceramic substrate and method of manufacturing a metal-ceramic substrate5 Jun 2025US 2025/0185166 A1
- Jet soldering apparatus22 May 2025US 2025/0162053 A1Senju Metal Industry Co., Ltd.
Most cited
By later US patents
- Applying solder to high density substrates139US 5,316,788 AInternational Business Machines Corporation · 1994
- Method of soldering components to printed circuit boards56US 5,111,991 AMotorola, Inc. · 1992
- Non-occluding mounting hole with solder pad for printed circuit boards55US 4,851,614 ACompaq Computer Corporation · 1989
- Multilayer PC board using polymer thick films50US 4,775,573 AWest-Tronics, Inc. · 1988
- Solder pad for printed circuit boards46US 5,414,223 AAST Research, Inc. · 1995