Method of soldering components to printed circuit boards
AssigneeMotorola, Inc.
InventorsRobert A. Clawson, John R. Thome
Life of this patent
Estimating the term…
Abstract
The need for solder paste or wave soldering to assemble printed circuit boards and components is eliminated by applying (100) a layer of solder to the exposed metal pads, annular rings and plated through holes of the printed circuit board. Leadless components are placed into a layer of `tack` flux applied (110) to the printed circuit board (120). The printed circuit board is heated to reflow (130) leadless components, and the solder in the holes is melted (140). The leads of the leaded components are heated (150) and inserted (160) into the molten solder in the holes. The assembly is then cooled (170) to solidify the solder around the component.
Claims22
A method of manufacturing printed circuit assemblies having a printed circuit board and components, comprising:
- applying solder material to exposed metal pads of the printed circuit board;
- applying heat to the printed circuit board, to effect melting of at least a portion of the solder material;
- applying heat to the components;
- placing the heated components into the molten solder;
- and
- cooling the assembly to solidify the solder material.
A method of manufacturing printed circuit assemblies having a printed circuit board and leaded components, comprising:
- applying solder material to exposed metal of the printed circuit board, a portion of the metal comprising plated through holes substantially filled with solder material;
- applying heat to the printed circuit board, to melt at least a portion of the solder material in the holes;
- applying heat to the leads of the components;
- inserting the heated component leads into the melted solder material in the plated through holes in the printed circuit board;
- and
- cooling the assembly to solidify the solder material.
A method of manufacturing printed circuit assemblies having a printed circuit board, leaded components, and surface mounted components, comprising:
- applying solder material to exposed metal pads of the printed circuit board by dipping, a portion of the pads comprising plated through holes, and removing the excess solder by means of a heated air stream;
- applying flux to the metal pads;
- applying heat to the printed circuit board, to melt at least a portion of the solder material in the holes;
- applying heat to the leads of the components;
- inserting the heated component leads into the melted solder material in the plated through holes in the printed circuit board;
- and cooling the assembly to solidify the solder material.
Dependencies are inferred from the claim text.