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US 12,434,316 B2Granted
Soldering apparatus
AssigneeSenju Metal Industry Co., Ltd.
InventorsYasuji Kawashima, Hiroshi Taguchi, Kyoko Kuramoto, Henri Hanzawa, Tomotake Kagaya, Katsuhiro Shinohara
Life of this patent
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Abstract
A solder removing mechanism 520 is a solder removing mechanism for removing solder from conveyance claws 510 for conveying a substrate 200 to which the solder is supplied. The solder removing comprise an abutment body 530 that can relatively pass through recesses 511 of the conveyance claws 510 or below the conveyance claws 510.
Claims5
A soldering apparatus comprising:
- a conveyance unit having conveyance claws for gripping and conveying a substrate, the conveyance claws moving along a conveyance rail;
- a supply unit for supplying molten solder to the substrate being conveyed by the conveyance claws of the conveyance unit;
- and
- a solder removing mechanism for removing solder from the conveyance claws after conveying the substrate soldered with the molten solder supplied from the supply unit,
- wherein the solder removing mechanism comprises an abutment plate that is configured to relatively pass through recesses of the conveyance claws or below the conveyance claws,
- wherein the abutment plate comprises a base end part, a distal end part that extends downstream in a direction of movement of the conveyance claws along the conveyance rail, and a bent part between the base end and the distal end part, and
- wherein the distal end part is located downstream of the bent part in the direction of movement of the conveyance claws along the conveyance rail and the distal end part extends downstream in the direction of movement of the conveyance claws.
4 more elements
Dependencies are inferred from the claim text.