Solder pad for printed circuit boards

A laminated printed circuit board having at least one through-hole comprising

• a plurality of conductor-containing layers,
• a solder pad surrounding said through-hole comprising a plurality of spokes radiating outward from said through-hole, said spokes intersecting a circular ring concentric to said through-hole at approximately a perpendicular angle,
• said solder pad being on an external layer of said printed circuit board disposed about said through-hole through said printed circuit board, and
• a plurality of via holes through said printed circuit board at the location of said solder pad, said via holes having a plated bore electrically interconnecting said solder pad with selected conductors on other layers of said printed circuit board.

A printed circuit board, having an upper layer and a lower layer, comprising

• at least one through-hole through said printed circuit board,
• a solder pad located on said lower layer of said printed circuit board disposed about and displaced from said through-hole through said printed circuit board,
• said solder pad comprising a plurality of spokes radiating outward from said through-hole, said spokes intersecting a circular ring concentric to said through-hole at approximately a perpendicular angle,
• a pad of conductive material on said upper layer of said printed circuit board disposed about and displaced from said through-hole through said printed circuit board, and
• a plurality of plated via holes passing through said solder pad and electrically interconnecting said solder pad on said lower layer to said pad of conductive material on said upper layer of said printed circuit board.

An electronic assembly comprising

• an electrically conductive chassis,
• a printed circuit board comprising at least one through-hole,
• a solder pad disposed about and displaced from said through-hole through said printed circuit board, said solder pad comprising a plurality of spokes radiating outward from said through-hole, said spokes intersecting a circular ring concentric to said through-hole at approximately a perpendicular angle, and
• a mounting bolt for attaching said printed circuit board to said chassis, said mounting bolt passing through said through-hole having said solder pad disposed about it, and electrically bonding said chassis to said solder pad.