Metal-ceramic substrate and method of manufacturing a metal-ceramic substrate

Abstract

A metal-ceramic substrate (1) as a carrier for electrical components, in particular in the form of a printed circuit board, comprising a ceramic element (20) and at least one metal layer (10, 20), wherein the at least one metal layer (10) and the ceramic element (30) extend along a main extension plane (HSE) and are arranged on top of one another along a stacking direction(S) running perpendicular to the main extension plane (HSE), wherein a bonding layer (12) is formed in the manufactured metal-ceramic substrate (1) between the at least one metal layer (10, 20) and the ceramic element (30), and wherein a bonding agent layer of the bonding layer (12) has a sheet resistance which is greater than 5 ohm/sq, more preferably greater than 10 ohm/sq and most preferably greater than 20 ohm/sq, wherein an interconnection (15) is formed in the ceramic element (30).

Dependencies are inferred from the claim text.