H05K 2203/0435
Metal coated solder
Official title: Metal coated solder, e.g. for passivation of solder balls
H05K2203/0435 (Metal coated solder) appears on 40 US grants and 20 published applications in this corpus.
Search patents in H05K- Granted patents
- 40
- Published applications
- 20
- Assignees
- 27
- Inventors
- 101
- Latest grant
- 9 Jul 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 0 |
| 2002 | 1 | 3 |
| 2003 | 1 | 1 |
| 2004 | 1 | 0 |
| 2005 | 1 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 2 |
| 2008 | 0 | 2 |
| 2009 | 1 | 3 |
| 2010 | 1 | 2 |
| 2011 | 2 | 3 |
| 2012 | 0 | 0 |
| 2013 | 2 | 0 |
| 2014 | 2 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Composite solder balls metallised on the surface and calibrated for the assembly of electronic boards9 Jul 2024US 12,030,138 B2Lipco Industrie
- Lead free solder columns and methods for making same2 Mar 2021US 10,937,752 B1The Topline Corporation
- Package base, package, electronic device, electronic apparatus, and moving object19 Sep 2017US 9,769,934 B2Seiko Epson Corporation
- Hybrid solder and filled paste in microelectronic packaging30 Dec 2014US 8,920,934 B2Intel Corporation
- Semiconductor package and method of manufacturing the same24 Jun 2014US 8,759,958 B2Samsung Electronics Co., Ltd.
- Composite solder balls metallised on the surface and calibrated for the assembly of electronic boards27 Oct 2022US 2022/0339742 A1Lifco Industrie
- Package base, package, electronic device, electronic apparatus, and moving object21 Jan 2016US 2016/0021752 A1Seiko Epson Corporation
- Hybrid solder and filled paste in microelectronic packaging2 Oct 2014US 2014/0291843 A1Intel Corporation
- Circuit board with buried circuit pattern27 Oct 2011US 2011/0259627 A1Samsung Electro-Mechanics Co., Ltd.
- Solder structure, method for forming the solder structure, and semiconductor module including the solder structure2 Jun 2011US 2011/0127669 A1Sanyo Electric Co., Ltd.
Most cited
By later US patents
- Electrically and thermally conductive adhesive transfer tape128US 4,606,962 AMinnesota Mining and Manufacturing Company · 1986
- Composite transversely plastic interconnect for microchip carrier91US 5,324,569 AHewlett-Packard Company · 1994
- Method and apparatus for forming solder balls and solder columns91US 5,542,174 AIntel Corporation · 1996
- Method of fabricating an electronic circuit device77US 5,865,365 AHitachi, Ltd. · 1999
- Tin-bismuth solder connection having improved high temperature properties, and process for forming same70US 5,320,272 AMotorola, Inc. · 1994