Back to results
US 2016/0021752 A1Published application
Package base, package, electronic device, electronic apparatus, and moving object
AssigneeSeiko Epson Corporation
InventorsTetsuro MIYAO, Hideki ISHIGAMI, Yukihiko SHIOHARA, Tetsuya OTSUKI, Hidefumi NAKAMURA
Life of this patent
Estimating the term…
Abstract
A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.
Claims15
A package base, comprising:
- a substrate containing a ceramic;
- and
- a bonding metal layer provided in a frame shape or a ring shape in plan view on the substrate, wherein
- the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.
1 more element
A package, comprising:
- a substrate containing a ceramic;
- a lid covering one side of the substrate;
- and
- a bonding metal layer provided in a frame shape or a ring shape in plan view and bonding the substrate and the lid to each other to form an internal space, wherein
- the bonding metal layer contains Ti, Ag, Cu, and a metal belonging to Group 6 in the periodic table.
2 more elements
Dependencies are inferred from the claim text.