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US 2011/0259627 A1Published application
Circuit board with buried circuit pattern
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHoe-Ku Jung, Je-Gwang Yoo, Myung-Sam Kang, Ji-Eun Kim, Jeong-Woo Park, Jung-Hyun Park
Life of this patent
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Abstract
A circuit board includes: an insulator having a groove; a circuit layer filling a portion of the groove; a solder pad on the circuit layer filling the remainder of the groove; and a circuit pattern electrically connected with the circuit layer, the circuit pattern buried in the insulator such that a portion of the circuit pattern is exposed at a surface of the insulator.
Claims6
A circuit board comprising:
- an insulator comprising a groove;
- a circuit layer filling a portion of the groove;
- a solder pad on the circuit layer filling the remainder of the groove;
- and
- a circuit pattern electrically connected with the circuit layer, the circuit pattern buried in the insulator such that a portion of the circuit pattern is exposed at a surface of the insulator.
2 more elements
Dependencies are inferred from the claim text.