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US 8,759,958 B2Granted
Semiconductor package and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsDong-Ki Ho, Boseong Kim
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a first package and a second package, a connection terminal disposed between the first and second packages and including a first solder ball and a second solder ball that are vertically stacked, a solder passivation layer with which a surface of at least one of the first and second solder balls is coated, and a ring-shaped short prevention part surrounding a coupling portion between the first and second solder balls.
Claims13
A semiconductor package comprising:
- a first package and a second package;
- a connection terminal disposed between the first and second packages and including a first solder ball and a second solder ball that are stacked;
- a conductive solder passivation layer disposed between the first solder ball and the second solder ball, the conductive solder passivation layer extended to coat a side surface of at least one of the first and second solder balls, and
- a non-conductive short prevention part surrounding a coupling portion between the first and second solder balls, wherein the short prevention part extends beyond the diameters of both solder balls and exposes side surfaces of the first solder ball and the second solder ball.
1 more element
A semiconductor package comprising:
- a first package and a second package;
- a connection terminal disposed between the first and second packages and including a first solder ball and a second solder ball that are stacked;
- a conductive solder passivation layer disposed between the first solder ball and the second solder ball, the conductive solder passivation layer extended to coat a side surface of at least one of the first and second solder balls;
- and
- a ring-shaped short prevention part surrounding a coupling portion between the first and second solder balls, wherein the ring-shaped short prevention part is non-conductive and extends beyond the diameters of both solder balls and exposes side surfaces of the first solder ball and the second solder ball.
2 more elements
A semiconductor package comprising:
- a first package and a second package;
- a connection terminal disposed between the first and second packages and including a first solder ball and a second solder ball that are stacked, the first solder ball connected to the first package and the second solder ball connected to the second package;
- a non-conductive short prevention part surrounding a coupling portion between the first and second solder balls which extends beyond the diameters of both solder balls and exposes side surfaces of the first solder ball and the second solder ball;
- and
- a conductive solder passivation layer disposed between the first solder ball and the second solder ball, the conductive solder passivation layer extended to coat side surfaces of the first and second solder balls.
2 more elements
Dependencies are inferred from the claim text.