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AssigneeIntel Corporation
InventorsHongjin Jiang, Arun Kumar C. Nallani, Rajen S. Sidhu, Martha A. Dudek, Weihua Tang
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Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect.
(canceled)
The structure of claim 10 The solder ball of claim 1, wherein the higher temperature solder comprises a lead-free alloy.
The structure of claim 10 The solder ball of claim 1, wherein the higher temperature solder has a melting point above 200° C.
The structure of claim 10 The solder ball of claim 1, wherein the lower temperature solder comprises an alloy including tin, bismuth, and copper.
The structure of claim 10 The solder ball of claim 1, wherein the lower temperature solder has a melting point below 200° C.
The structure of claim 10 The solder ball of claim 1, wherein the coating covers the entire exterior surface of the droplet.
The structure of claim 10 The solder ball of claim 1, further comprising an interface material between the droplet and the coating.
A solder structure comprising:
18-20. (canceled)
Dependencies are inferred from the claim text.