H05K 2203/0475
Molten solder just before placing the component
H05K2203/0475 (Molten solder just before placing the component) appears on 28 US grants and 25 published applications in this corpus.
Search patents in H05K- Granted patents
- 28
- Published applications
- 25
- Assignees
- 27
- Inventors
- 83
- Latest grant
- 15 Nov 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 1 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 2 | 0 |
| 2008 | 1 | 1 |
| 2009 | 2 | 1 |
| 2010 | 1 | 2 |
| 2011 | 2 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 1 | 4 |
| 2016 | 0 | 0 |
| 2017 | 2 | 1 |
| 2018 | 0 | 2 |
| 2019 | 1 | 2 |
| 2020 | 1 | 3 |
| 2021 | 3 | 0 |
| 2022 | 1 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Vertical soldering technology for 3D circuit assembly15 Nov 2022US 11,501,982 B1The United States of Americas as represented by the Secretary of the Army
- Flux residue detection2 Mar 2021US 10,939,600 B2International Business Machines Corporation
- Wafer-level methods of fabricating semiconductor device packages and related packages19 Jan 2021US 10,896,894 B2Micron Technology, Inc.
- Electronic device comprising an electronic component mounted on a support substrate and assembly method19 Jan 2021US 10,897,822 B2STMicroelectronics (Grenoble 2) SAS
- Interconnection including a cable assembly and a board assembly, a board assembly for an interconnection and a method for making an interconnection21 Jan 2020US 10,541,479 B2Md Elektronik GmbH
- Materials for semiconductor package mount applications and methods of using the same21 Nov 2024US 2024/0389240 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Materials for semiconductor package mount applications and methods of using the same28 Mar 2024US 2024/0107682 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Laser soldering method and device6 Oct 2022US 2022/0320811 A1O. M. C. Co., Ltd.
- Electronic device comprising an electronic component mounted on a support substrate and assembly method24 Sep 2020US 2020/0305283 A1STMicroelectronics (Grenoble 2) SAS
- Flux residue detection28 May 2020US 2020/0170155 A1International Business Machines Corporation
Most cited
By later US patents
- Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement81US 5,516,030 ACompaq Computer Corporation · 1996
- Method of soldering components to printed circuit boards56US 5,111,991 AMotorola, Inc. · 1992
- Reflow soldering method53US 6,010,061 AMicron Custom Manufacturing Services, Inc. · 2000
- Method of solder reflow assembly18US 4,334,646 AHarris Corporation · 1982
- Self-assembled electrical contacts14US 8,318,595 B2The United States of America as represented by the Secretary of the Army · 2012