Laser soldering method and device
AssigneeO.M.C. Co., Ltd.
InventorShinji WATANABE
Life of this patent
Estimating the term…
Abstract
A hot wind is blown to a land and a lead from the underside of a printed board, to perform preheating. At the start of preheating or after start of preheating, a laser beam is applied to a soldering point, and meanwhile, wire solder is fed to a position contacting with the soldering point. The fed wire solder is melted by the laser beam. After soldering is finished, feeding of the wire solder is stopped. Application of the laser beam is stopped, to solidify the melted solder.
Claims11
A laser soldering method in which wire solder fed toward a through hole of a printed board is melted by a laser beam, and a lead, inserted through the through hole, of an electronic component mounted on an upper surface side of the printed board is soldered to a land provided to the through hole, wherein
- the laser beam is applied vertically or in an inclined state from an underside to the land at a soldering point,
- a helical-flow hot wind is blown from an underside of the printed board to the land and the lead protruding downward from the through hole, to preheat the land and the lead,
- at a time of starting the preheating or after the preheating is started, the laser beam is applied to the land and the lead from the underside of the printed board, and meanwhile, the wire solder is fed to a position contacting with either the land or the lead from the underside of the printed board,
- subsequently, the fed wire solder is melted by the laser beam, and the land and the lead are connected by the melted solder, and
- thereafter, feeding of the wire solder is stopped, and at a time of stopping the feeding of the wire solder or after the feeding of the wire solder is stopped, application of the laser beam is stopped, to solidify the melted solder.
A laser soldering device for soldering a lead of an electronic component to a land of a printed board by a laser beam, the laser soldering device comprising:
- a support base configured to support the printed board in a state in which the electronic component is mounted at an upper surface of the printed board and the lead of the electronic component protrudes downward from a through hole of the printed board;
- an emission head provided under the printed board so as to be vertical or inclined relative to the printed board, the emission head being configured to emit the laser beam vertically or in an inclined state toward the land;
- a wire solder feeding portion configured to feed wire solder to a position contacting with either the land or the lead at a time of soldering;
- a hollow protection nozzle provided at an emission port of the emission head and extending from the emission port toward the printed board present upward, the protection nozzle having a pass hole at a tip thereof facing the printed board;
- and
- a heating gas supply pipe provided to the protection nozzle and configured to supply heating gas, the heating gas supply pipe being connected in a tangent direction of an inner circumferential surface of the protection nozzle so that a helical-flow hot wind is blown out from the pass hole toward the printed board.
Dependencies are inferred from the claim text.