Electronic device comprising an electronic component mounted on a support substrate and assembly method

A method for assembling an electronic component with second electric contacts above a support substrate with first electric contacts, comprising:

• providing a shim made of a first electrically conducting material at each first electric contact of the support substrate, wherein providing comprises forming each shim from an end portion of a wire that is soldered onto the first electric contact of the support substrate and isolating the end portion from the wire;
• depositing a droplet of brazing paste made of a second electrically conducting material at each shim, wherein the droplet coats the shim;
• placing the electronic component above the shims, so that the second electric contacts of the electric component are above the shims and so that the droplets of brazing paste are in contact with the corresponding first electric contacts of the support substrate and the second electric contacts of the electronic component;
• hardening the droplets of brazing paste so as to produce an electric connection coating which surrounds each shim in a position between the corresponding first and second electric contacts of the support substrate and the electronic component, respectively.