Interconnection including a cable assembly and a board assembly, a board assembly for an interconnection and a method for making an interconnection

A board assembly for making an interconnection, the board comprising:

• at least three layers stacked on each other in a longitudinal direction, the at least three layers including an intermediate layer and first and second outer layers, the intermediate layer being disposed between the first outer layer and the second outer layer, the at least three layers being joined together, at least one of the first and second outer layers being electrically conductive, and the intermediate layer including a dielectric material;
• a recess disposed between the first outer layer and the second outer layer so as to form a cable-receiving space at a first side edge of the board assembly, the recess and cable-receiving space being formed by the first and second outer layers projecting beyond the intermediate layer at the first side edge;
• at least one first inner-conductor contact opening extending through at least one of the first and second outer layers and opening into the cable-receiving space;
• and
• at least one first inner-conductor solder deposit disposed in the first inner-conductor contact opening.

A method for making an interconnection between a board assembly and a cable assembly, the method comprising:

• manufacturing a board assembly including at least three layers stacked on each other in a longitudinal direction, the at least three layers including a dielectric intermediate layer and first and second outer layers, the intermediate layer being disposed between the first outer layer and the second outer layer, at least one of the first and second outer layers being electrically conductive, a first recess being formed between the first outer layer and the second outer layer so as to form a cable-receiving space at a first side edge of the board assembly, the recess and cable-receiving space being formed by the first and second outer layers projecting beyond the intermediate layer at the first side edge;
• forming at least one first inner-conductor contact opening into the board assembly, the first inner-conductor contact opening extending through at least one of the first and second outer layers and opening into the cable-receiving space;
• exposing an inner conductor of at least one first cable of the cable assembly;
• placing at least one first inner-conductor solder deposit into the at least one first inner-conductor contact opening and/or on the exposed inner conductor of the at least one first cable of the cable assembly;
• inserting the inner conductor of the at least one first cable at the first side edge into the cable-receiving space in such a manner that the inner conductor of the at least one first cable is disposed at an offset in the longitudinal direction relative to the at least one first inner-conductor contact opening;
• and
• heating the at least one first inner-conductor solder deposit until it is molten and electrically conductively connects the inner conductor of the at least one first cable via a first soldered inner-conductor connection to a first inner-conductor connection region of at least one of the first and second outer layers, at least in a region of the first inner-conductor contact opening.

An interconnection comprising:

• a cable assembly including at least one first cable, the first cable having an inner conductor;
• and
• a board assembly comprising:
• at least three layers stacked on each other in a longitudinal direction, the at least three layers including an intermediate layer and first and second outer layers, the intermediate layer being disposed between the first outer layer and the second outer layer, the at least three layers being directly or indirectly joined together, at least one of the first and second outer layers being electrically conductive, and the intermediate layer including a dielectric material;
• a recess disposed between the first outer layer and the second outer layer so as to form a cable-receiving space at a first side edge of the board assembly;
• and
• at least one first inner-conductor contact opening extending through at least one of the first and second outer layers and opening into the cable-receiving space,
• wherein the inner conductor of the at least one first cable is inserted at the first side edge into the cable-receiving space and is disposed at an offset in the longitudinal direction relative to the at least one first inner-conductor contact opening,
• wherein the inner conductor of the at least one first cable is electrically conductively soldered via a first soldered inner-conductor connection to a first inner-conductor connection region of at least one of the first and second outer layers, at least in a region of the first inner-conductor contact opening, and
• wherein:
• the board assembly further includes:
• a) a first cover layer which is disposed on the first outer layer such that the first outer layer lies between the intermediate layer and the first cover layer, the first inner-conductor contact opening extending through the first cover layer;
• and/or
• b) a second cover layer which is disposed on the second outer layer such that the second outer layer lies between the intermediate layer and the second cover layer, the first inner-conductor contact opening extending through the second cover layer;
• and/or
• the recess extends only over part of the thickness of the intermediate layer such that the intermediate layer includes two spaced-apart portions which are disposed at the first and second outer layers, respectively, and bound the cable-receiving space in the longitudinal direction, the first inner-conductor contact opening extending through at least one of the two spaced-apart portions;
• and/or
• an inner wall of the first inner-conductor contact opening is plated with a metal coating.

An interconnection comprising:

• a cable assembly including at least one first cable, the first cable having an inner conductor;
• and
• a board assembly comprising:
• at least three layers stacked on each other in a longitudinal direction, the at least three layers including an intermediate layer and first and second outer layers, the intermediate layer being disposed between the first outer layer and the second outer layer, the at least three layers being directly or indirectly joined together, at least one of the first and second outer layers being electrically conductive, and the intermediate layer including a dielectric material;
• a recess disposed between the first outer layer and the second outer layer so as to form a cable-receiving space at a first side edge of the board assembly;
• and
• at least one first inner-conductor contact opening extending through at least one of the first and second outer layers and opening into the cable-receiving space,
• wherein the inner conductor of the at least one first cable is inserted at the first side edge into the cable-receiving space and is disposed at an offset in the longitudinal direction relative to the at least one first inner-conductor contact opening,
• wherein the inner conductor of the at least one first cable is electrically conductively soldered via a first soldered inner-conductor connection to a first inner-conductor connection region of at least one of the first and second outer layers, at least in a region of the first inner-conductor contact opening, and
• wherein:
• the at least one first cable of the cable assembly further includes an outer conductor which is galvanically isolated from the inner conductor by a dielectric;
• at least one first outer-conductor contact opening extends through at least one of the first and second outer layers and opens into the cable-receiving space;
• the first outer-conductor contact opening is disposed closer to the first side edge than the first inner-conductor contact opening;
• the outer conductor of the at least one first cable is inserted at the first side edge into the cable-receiving space and is disposed at an offset in the longitudinal direction relative to the at least one first outer-conductor contact opening;
• the outer conductor of the at least one first cable is electrically conductively soldered via a first soldered outer-conductor connection to a first outer-conductor connection region of at least one of the first and second outer layers, at least in a region of the first outer-conductor contact opening;
• and
• the first inner-conductor connection region is galvanically isolated from the first outer-conductor connection region.

An interconnection comprising:

• a cable assembly including at least one first cable, the first cable having an inner conductor;
• and
• a board assembly comprising:
• at least three layers stacked on each other in a longitudinal direction, the at least three layers including an intermediate layer and first and second outer layers, the intermediate layer being disposed between the first outer layer and the second outer layer, the at least three layers being directly or indirectly joined together, at least one of the first and second outer layers being electrically conductive, and the intermediate layer including a dielectric material;
• a recess disposed between the first outer layer and the second outer layer so as to form a cable-receiving space at a first side edge of the board assembly;
• and
• at least one first inner-conductor contact opening extending through at least one of the first and second outer layers and opening into the cable-receiving space,
• wherein the inner conductor of the at least one first cable is inserted at the first side edge into the cable-receiving space and is disposed at an offset in the longitudinal direction relative to the at least one first inner-conductor contact opening,
• wherein the inner conductor of the at least one first cable is electrically conductively soldered via a first soldered inner-conductor connection to a first inner-conductor connection region of at least one of the first and second outer layers, at least in a region of the first inner-conductor contact opening, and
• wherein:
• the cable assembly includes at least one second cable having an inner conductor;
• the cables of the cable assembly are arranged side by side;
• at least one second inner-conductor contact opening extends through at least one of the first and second outer layers and opens into the cable-receiving space;
• the inner conductor of the at least one second cable is inserted at the first side edge into the cable-receiving space and is disposed at an offset in the longitudinal direction relative to the at least one second inner-conductor contact opening;
• the inner conductor of the at least one second cable is electrically conductively soldered via a second soldered inner-conductor connection to a second inner-conductor connection region of at least one of the first and second outer layers, at least in a region of the second inner-conductor contact opening;
• and
• a first inner-conductor connection region and the second inner-conductor connection region are galvanically isolated from each other.

An interconnection comprising:

• a cable assembly including at least one first cable, the first cable having an inner conductor;
• and
• a board assembly comprising:
• at least three layers stacked on each other in a longitudinal direction, the at least three layers including an intermediate layer and first and second outer layers, the intermediate layer being disposed between the first outer layer and the second outer layer, the at least three layers being directly or indirectly joined together, at least one of the first and second outer layers being electrically conductive, and the intermediate layer including a dielectric material;
• a recess disposed between the first outer layer and the second outer layer so as to form a cable-receiving space at a first side edge of the board assembly;
• and
• at least one first inner-conductor contact opening extending through at least one of the first and second outer layers and opening into the cable-receiving space,
• wherein the inner conductor of the at least one first cable is inserted at the first side edge into the cable-receiving space and is disposed at an offset in the longitudinal direction relative to the at least one first inner-conductor contact opening,
• wherein the inner conductor of the at least one first cable is electrically conductively soldered via a first soldered inner-conductor connection to a first inner-conductor connection region of at least one of the first and second outer layers, at least in a region of the first inner-conductor contact opening, and
• wherein:
• the cable assembly includes a cable-collecting and aligning device which is made of or includes a plastic material and includes a main body;
• the cable-collecting and aligning device is immovably disposed on the at least one first cable or on all cables;
• the cable-collecting and aligning device includes at least one fastener formed on the main body;
• and
• the at least one fastener is adapted to secure the cable-collecting and aligning device to the board assembly in such a manner that the at least one first cable or all cables of the cable assembly is/are disposed in a fixed position within the cable-receiving space.