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US 4,334,646 AGranted
Method of solder reflow assembly
AssigneeHarris Corporation
InventorHenry J. Campbell
Life of this patent
Estimating the term…
Abstract
A solder reflow assembly technique wherein a substrate with solder pattern is immersed in a hot bath; after reflow of the solder, elements having a solder pattern therein are individually positioned on the substrate solder pattern; and the elements are aligned on the substrate by the surface tension created by the capillary action of the molten solder.
Claims15
A method of attaching and aligning elements on a substrate comprising:
- providing a metallic pattern on a planar surface of a substrate;
- providing a metallic pattern on an element;
- immersing said substrate in a hot liquid bath having a temperature sufficient to melt said metallic pattern;
- after said metallic pattern on said substrate has melted, immersing said element in said bath and positioning said element with its metallic pattern on the metallic pattern of said substrate without traversing said planar surface of said substrate so that the metallic pattern of said substrate and said element are aligned solely by capillary action of said melted metallic patterns;
- and
- removing said assembled substrate and element from said bath to cool.
3 more elements
A method of reworking a substrate having a planar surface with a plurality of elements soldered thereto comprising:
- immersing said substrate in a hot liquid bath having a temperature sufficient to melt said solder;
- removing a selected element from said substrate planar surface after said solder has become molten;
- immersing a substitute element in said bath and positioning said substitute element on said immersed substrate planar surface at a location of said removed selected element so that said substitute element is aligned solely by capillary action of said molten solder;
- and
- removing said reworked substrate and element from said bath to cool.
2 more elements
Dependencies are inferred from the claim text.