H05K 2203/041
Solder preforms in the shape of solder balls
H05K2203/041 (Solder preforms in the shape of solder balls) appears on 789 US grants and 628 published applications in this corpus.
Search patents in H05K- Granted patents
- 789
- Published applications
- 628
- Assignees
- 310
- Inventors
- 1,568
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 9 | 0 |
| 1993 | 9 | 0 |
| 1994 | 12 | 0 |
| 1995 | 14 | 0 |
| 1996 | 10 | 0 |
| 1997 | 25 | 0 |
| 1998 | 30 | 0 |
| 1999 | 39 | 0 |
| 2000 | 51 | 0 |
| 2001 | 58 | 18 |
| 2002 | 42 | 33 |
| 2003 | 36 | 32 |
| 2004 | 23 | 28 |
| 2005 | 28 | 50 |
| 2006 | 32 | 47 |
| 2007 | 26 | 39 |
| 2008 | 20 | 46 |
| 2009 | 29 | 51 |
| 2010 | 34 | 27 |
| 2011 | 32 | 21 |
| 2012 | 23 | 21 |
| 2013 | 11 | 9 |
| 2014 | 18 | 17 |
| 2015 | 12 | 33 |
| 2016 | 21 | 20 |
| 2017 | 13 | 12 |
| 2018 | 18 | 21 |
| 2019 | 15 | 10 |
| 2020 | 12 | 8 |
| 2021 | 8 | 17 |
| 2022 | 12 | 18 |
| 2023 | 7 | 19 |
| 2024 | 12 | 15 |
| 2025 | 17 | 8 |
| 2026 | 9 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate structure connected on basis of solder ball and elastic body7 Jul 2026US 12,677,371 B2Samsung Electronics Co., Ltd.
- Stepped package and recessed circuit board7 Jul 2026US 12,677,375 B2Intel Corporation
- Assembling method of electronic module28 Apr 2026US 12,615,720 B2Delta Electronics, Inc.
- Integrated circuit (IC) assembly including a direct connection pad structure for a surface-mount device (SMD)21 Apr 2026US 12,610,472 B2Dell Products L. P.
- Lead-free and antimony-free solder alloy, solder ball, and solder joint17 Mar 2026US 12,576,463 B2Senju Metal Industry Co., Ltd.
- Ball grid array package24 Sep 2026US 2026/0292989 A1LG Innotek Co., Ltd.
- Semiconductor package warpage and alignment management17 Sep 2026US 2026/0282241 A1Arm Limited
- Electronic module13 Aug 2026US 2026/0239542 A1Delta Electronics, Inc.
- Solder preform assembly and methods of preforming solder for electronic board assembly2 Apr 2026US 2026/0096030 A1Honeywell Federal Manufacturing & Technologies, LLC
- Electronic package and manufacturing method thereof19 Mar 2026US 2026/0083000 A1Siliconware Precision Industries Co., Ltd.
Most cited
By later US patents
- Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders244US 5,203,075 AInernational Business Machines Corporation · 1993
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Flexible connectors for microelectronic elements192US 6,086,386 ATessera, Inc. · 2000
- Method for fabricating an electronic device having solder joints186US 5,641,113 AOki Electronic Industry Co., Ltd. · 1997
- Solder ball connect pad-on-via assembly process181US 5,275,330 AInternational Business Machines Corporation · 1994