Electronic package and manufacturing method thereof

Abstract

An electronic package and a manufacturing method thereof are provided. The electronic package includes a carrier structure, an electronic element, a bridge element, an encapsulation layer, and a photonic element. The electronic element and the bridge element are disposed on a second surface of the carrier structure to be electrically connected to the carrier structure. The encapsulation layer covers the electronic element and the bridge element. The photonic element is disposed on a surface of the encapsulation layer and is electrically connected to the bridge element. In the electronic package and the manufacturing method thereof, the photonic element is disposed after the formation and grinding of the encapsulation layer are completed, the photonic element can be prevented from covering by the encapsulation, thereby contamination or damage to the light transmitters and the light receivers of the photonic element can be avoided.

Dependencies are inferred from the claim text.