Lead-free and antimony-free solder alloy, solder ball, and solder joint

Abstract

Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint, which have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy has an alloy composition consisting of, by mass %, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.005 to 0.090% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.006≤(Ag+Cu+Ni)×Ge<0.023 (1), (Sn/Cu)×(Ni×Ge)/(Ni+Ge)<0.89 (2). Ag, Cu, Ni, Ge, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.

Dependencies are inferred from the claim text.