Integrated circuit (IC) assembly including a direct connection pad structure for a surface-mount device (SMD)

An integrated circuit (IC) assembly, including:

• a printed circuit board (PCB), including:
• a first stripline;
• a ground layer;
• a first cavity extending from a first surface of the PCB to the first stripline, the first cavity exposing a first portion of the first stripline;
• and
• a second cavity extending from the first surface of the PCB to the ground layer, the second cavity exposing a second portion of the ground layer;
• wherein the first cavity includes first solder paste in contact with the first portion of the first stripline exposed at the first cavity,
• wherein the second cavity includes second solder paste in contact with the second portion of the ground layer exposed at the second cavity,
• a ball grid array (BGA), including a first solder ball and a second solder ball;
• wherein the BGA is coupled to the PCB, including:
• the first solder ball positioned within the first cavity such that the first solder ball contacts the first solder paste in the first cavity;
• and
• the second solder ball positioned with the second cavity such that the second solder ball contacts the second solder paste in the second cavity.