Loading patent…
AssigneeFujitsu Limited
InventorsMasayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake, Junichi Kasai, Nobuo Kamehara, Yasuo Yamagishi, Masataka Mizukoshi, Yutaka Yamada, Susumu Abe
Estimating the term…
A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a <110> crystallographic plane, and an orientation flat in a <1-11> crystallographic plane. The cavities are formed on the flat surface of the plate by etching, using a mask having openings in the shape of rhombus arranged such that one side of the rhombus is generally parallel to the <1-11> crystallographic plane. As a result, the cavities having wedge-shaped bottom are formed. The cavities are then filled with a solder paste and are heated to form solder balls in the cavities while the plate in an inclined position. The solder balls are then transferred from the plate to a semiconductor chip.
A method for fabricating a semiconductor device, said method comprising the steps of:
A method for fabricating a semiconductor device, said method comprising the steps of:
A method for fabricating a semiconductor device, said method comprising the steps of:
Dependencies are inferred from the claim text.