H05K 2203/048
Self-alignment during soldering
Official title: Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
H05K2203/048 (Self-alignment during soldering) appears on 150 US grants and 137 published applications in this corpus.
Search patents in H05K- Granted patents
- 150
- Published applications
- 137
- Assignees
- 112
- Inventors
- 326
- Latest grant
- 8 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 0 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 1 |
| 2002 | 1 | 7 |
| 2003 | 3 | 4 |
| 2004 | 8 | 9 |
| 2005 | 7 | 7 |
| 2006 | 5 | 5 |
| 2007 | 5 | 11 |
| 2008 | 2 | 4 |
| 2009 | 7 | 4 |
| 2010 | 3 | 5 |
| 2011 | 5 | 5 |
| 2012 | 7 | 0 |
| 2013 | 1 | 3 |
| 2014 | 1 | 1 |
| 2015 | 3 | 8 |
| 2016 | 3 | 10 |
| 2017 | 5 | 11 |
| 2018 | 12 | 6 |
| 2019 | 9 | 11 |
| 2020 | 3 | 5 |
| 2021 | 5 | 5 |
| 2022 | 7 | 6 |
| 2023 | 7 | 2 |
| 2024 | 1 | 5 |
| 2025 | 1 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and production method thereof8 Jul 2025US 12,354,937 B2Denso Corporation
- Electro-optical device comprising a plurality of terminals having a plurality of recessed portions including first and second recessed portions and electronic apparatus24 Sep 2024US 12,099,277 B2Seiko Epson Corporation
- Information handling system interchangeable solder pads28 Nov 2023US 11,832,393 B2Dell Products L. P.
- Semiconductor module and electronic apparatus14 Nov 2023US 11,818,844 B2Canon Kabushiki Kaisha
- Right angle sidewall and button interconnects for molded SiPs19 Sep 2023US 11,765,838 B2Apple Inc.
- Multilayer board25 Jun 2026US 2026/0181775 A1Alps Alpine Co., Ltd.
- Printed circuit board and electronic device comprising same13 Nov 2025US 2025/0351263 A1Samsung Electronics Co., Ltd.
- Modular routable circuit board conductor blocks14 Nov 2024US 2024/0381541 A1Microsoft Technology Licensing, LLC
- Bonding sheet and method for producing same15 Aug 2024US 2024/0269780 A1Nitto Denko Corporation
- Circuit board, electronic component package including the same, and manufacturing method thereof15 Aug 2024US 2024/0276640 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Pad grid array for receiving a solder bumped chip carrier132US 4,940,181 AMotorola, Inc. · 1990
- Shaped, self-aligning micro-bump structures123US 5,477,086 ALSI Logic Corporation · 1995
- Ultra-small LED electrode assembly and method for manufacturing same114US 9,773,761 B2Psi Co., Ltd. · 2017
- Self-aligned transition between a transmission line and a module107US 6,940,361 B1Nokia Corporation · 2005
- Systems having shaped, self-aligning micro-bump structures65US 5,767,580 ALSI Logic Corporation · 1998