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US 11,765,838 B2Granted
Right angle sidewall and button interconnects for molded SiPs
AssigneeApple Inc.
InventorsBilal Mohamed Ibrahim Kani, Ali N. Ergun, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Benjamin J. Grena, David M. Kindlon, Lan H. Hoang
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Abstract
Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
Claims16
An electronic module comprising:
- a system-in-package including:
- a routing substrate;
- a first electronic component mounted on a first side of the routing substrate and encapsulated in a first molding compound layer;
- a first lateral interconnect bonded to the first side of the routing substrate, wherein the first lateral interconnect extends through and is encapsulated in the first molding compound layer, and is exposed along a first side surface of the first molding compound layer;
- and
- a flexible circuit mounted on the first side surface of the first molding compound layer, wherein a first landing pad of the flexible circuit is in electrical contact with the first lateral interconnect exposed along the first side surface of the first molding compound layer.
3 more elements
Dependencies are inferred from the claim text.