Semiconductor device and production method thereof

A semiconductor device comprising:

• a semiconductor package which is equipped with a plurality of electrodes;
• and
• a mount member which is equipped with a plurality of lands and on which the semiconductor package is mounted, wherein:
• the semiconductor package has the electrodes joined to the lands through solders,
• at least a subset of the electrodes work as position/orientation control electrodes to control a position and orientation of the semiconductor package relative to a mount surface that is a surface of the mount member which faces the semiconductor package,
• at least a subset of the lands work as position/orientation control lands to control the position and orientation of the semiconductor package relative to the mount surface of the mount member,
• each of the position/orientation control electrodes is arranged in a planar view thereof to have a center thereof offset from a center of a respective one of the position/orientation control lands which is joined to the position/orientation control electrode through the solder, each of the position/orientation control electrodes lying inside an outline of a corresponding one of the position/orientation control lands
• the number of position/orientation control lands and the number of position/orientation control electrodes are plural,
• each of the position/orientation control electrodes is exposed outside only a lower surface of the semiconductor package which faces the mount member,
• each of the position/orientation control lands is arranged in a planar view thereof in a region located inside an outline of the semiconductor package,
• a direction from the center of each of the position/orientation control electrodes to the center of a corresponding one of the position/orientation control lands is defined as an offset direction toward a center of the semiconductor package in a planar view thereof, a spread of each of the position/orientation control lands relative to a corresponding one of the position/orientation control electrodes becomes larger in the offset direction than in a direction opposite the offset direction,
• each of the position/orientation control lands and a respective one of the position/orientation control electrodes which are joined together through one of the solders are defined as a position/orientation control pair, the position/orientation control pairs being arranged to be symmetrical with respect to the center of the semiconductor package in the planar view thereof,
• each solder of the solders between all of the position/orientation control electrodes and all of the position/orientation lands is arranged in the planar view thereof only inside an outline of the semiconductor package,
• the position/orientation control electrodes are designed as auxiliary electrodes which are different from signal electrodes, as included in the electrodes, to which signals outputted from the semiconductor package are transmitted, and
• of the lands, the position/orientation control lands are designed as auxiliary lands which are different from signal lands to which the signals are transmitted.