Information handling system interchangeable solder pads
AssigneeDell Products L.P.
InventorsYu-Lin Tsai, Chia-Hsien Lu, Chun-Min He, RungLung Lin, Chin-Chung Wu
Life of this patent
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Abstract
An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.
Claims7
A method for manufacture of an information handling system circuit board, the method comprising:
- forming a solder pad conductive area having an intervening non-conductive area;
- disposing solder paste over the conductive area;
- placing a first or a second component on the solder pad;
- when placing the first component on the solder pad, placing a conductive surface of the first component over the intervening non-conductive area;
- and
- when placing the second component on the solder pad, placing a conductive surface of the second component adjacent to the intervening non-conductive area;
- wherein the forming a solder pad further comprises:
- disposing first and second rectangles in the conductive area in a spaced parallel relationship to define the non-conductive area between them;
- and
- disposing a third rectangle in the conductive area to interface the first and second rectangles.
Dependencies are inferred from the claim text.