Semiconductor module and electronic apparatus

A semiconductor module comprising:

• a semiconductor device having a first land and a second land;
• a printed wiring board having an insulating substrate, a solder resist having a plurality of openings and a plurality of guiding portions disposed on a main surface of the insulating substrate, and a fourth land and a fifth land exposed from the plurality of openings disposed on the main surface of the insulating substrate;
• a chip component having a first electrode and a second electrode disposed across a distance in a longitudinal direction and being disposed between the printed wiring board and the semiconductor device;
• a first solder joint configured to bond the first land, the fourth land, and the first electrode;
• a second solder joint configured to bond the second land, the fifth land, and the second electrode;
• a first conductor pattern extending from the fourth land disposed on the main surface of the insulating substrate in a first direction intersecting with the longitudinal direction of the chip component;
• and a second conductor pattern extending from the fifth land disposed on the main surface of the insulating substrate in a second direction intersecting with the longitudinal direction of the chip component, wherein the first conductor pattern and the second conductor pattern are each covered by one or more of the plurality of guiding portions of the solder resist, wherein a width of the first conductor pattern is larger than or equal to a length of the first electrode in the longitudinal direction of the chip component, and wherein a width of the second conductor pattern is larger than or equal to a length of the second electrode in the longitudinal direction of the chip component.