H05K 2203/045
Solder-filled plated through-hole [pth] during processing wherein the solder is removed from
Official title: Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing
H05K2203/045 (Solder-filled plated through-hole [pth] during processing wherein the solder is removed from) appears on 31 US grants and 19 published applications in this corpus.
Search patents in H05K- Granted patents
- 31
- Published applications
- 19
- Assignees
- 23
- Inventors
- 66
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 2 |
| 2002 | 2 | 0 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 3 |
| 2019 | 2 | 0 |
| 2020 | 0 | 5 |
| 2021 | 5 | 0 |
| 2022 | 0 | 1 |
| 2023 | 1 | 1 |
| 2024 | 1 | 2 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display device14 Apr 2026US 12,604,402 B2Boe Technology Group Co., Ltd.
- Display device and manufacturing method thereof16 Jul 2024US 12,041,720 B2Boe Technology Group Co., Ltd.
- Display device and manufacturing method thereof27 Jun 2023US 11,690,174 B2Boe Technology Group Co., Ltd.
- Method for producing a printed circuit board having thermal through-contacts7 Sep 2021US 11,116,071 B2ZKW Group GmbH
- Printed circuit boards including a rigid region on which devices or connectors are to be mounted and a flexible region that is bendable, and methods of manufacturing same17 Aug 2021US 11,096,273 B2Amosense Co., Ltd.
- Wiring substrate for electronic control device, and method for manufacturing same24 Oct 2024US 2024/0357736 A1Hitachi Astemo, Ltd.
- Display device3 Oct 2024US 2024/0334603 A1Boe Technology Group Co., Ltd.
- Display device and manufacturing method thereof31 Aug 2023US 2023/0276572 A1Boe Technology Group Co., Ltd.
- Display device and manufacturing method thereof23 Jun 2022US 2022/0201858 A1Boe Technology Group Co., Ltd.
- Repairing defective through-holes30 Jul 2020US 2020/0245469 A1International Business Machines Corporation
Most cited
By later US patents
- Electronic part including a thin body of molding resin107US 5,729,437 ASeiko Epson Corporation · 1998
- Method for forming traces on side edges of printed circuit boards and devices formed thereby106US 5,140,745 A1992
- Single step solder process77US 4,761,881 AInternational Business Machines Corporation · 1988
- Method for attaching through-hole devices to a circuit board using solder paste64US 5,129,573 ACompaq Computer Corporation · 1992
- Method of soldering components to printed circuit boards56US 5,111,991 AMotorola, Inc. · 1992