Back to results
US 4,761,881 AGranted
Single step solder process
AssigneeInternational Business Machines Corporation
InventorsMuhammad-Yusuf J. Bora, Karl G. Hoebener
Life of this patent
Estimating the term…
Abstract
A technique is disclosed for attaching a variety of device types to the same side of a printed circuit board including a single solder application step for both surface mountable and leaded components, placement of the devices, drying of the solder and solder reflow.
Claims2
An improved method of surface mountable components to both sides and leaded components to one side of a printed circuit board having first and second sides comprising the sequential steps of:
- screening solder paste on lands for surface mount components located on the first side of the board;
- depositing adhesive on surface mount components receiving sites located on the first side of the board;
- placing the surface mount components on the first side of the board;
- curing the deposited adhesive;
- inverting the board;
- screening solder paste on surface mount component lands and into the through hole locations on the second side of the board;
- placing components on the second side of the board;
- drying the screened solder paste;
- reflowing the solder;
- and
- cleaning the board.
8 more elements
Dependencies are inferred from the claim text.