Printed circuit boards including a rigid region on which devices or connectors are to be mounted and a flexible region that is bendable, and methods of manufacturing same
AssigneeAmosense Co., Ltd.
InventorSung-Baek Dan
Life of this patent
Estimating the term…
Abstract
Disclosed are a printed circuit board manufactured by filling a via hole formed in a flexible board and a via hole formed in a cured base substrate and then laminating the flexible board and the cured base substrate and a method of manufacturing same. The method includes preparing a flexible board including a flexible region and a rigid region, preparing a cured base substrate, and laminating the cured base substrate on the rigid region of the flexible board, in which during the laminating, via holes respectively formed in the flexible board and the cured base substrate are first filled with a conductive material and then the flexible board and the cured base substrate are laminated.
Claims3
A method of manufacturing a printed circuit board, the method comprising:
- preparing a flexible board including a flexible region and a rigid region;
- preparing a cured base substrate;
- and
- laminating the cured base substrate on the rigid region of the flexible board,
- wherein the preparing of the flexible board comprises:
- preparing a flexible base substrate;
- forming a first via hole in a flexible region of the flexible base substrate;
- forming a plating layer by plating one surface of the flexible base substrate and an inside wall surface of the first via hole;
- etching the plating layer to form an internal circuit pattern;
- and
- forming a protective layer to cover the internal circuit pattern,
- forming a second via hole within the rigid region of the flexible board;
- filling the second via hole formed in the flexible board with a conductive material,
- wherein the preparing the cured base substrate comprises:
- forming a via hole communicating with the second via hole in the cured base substrate;
- filling the via hole communicating with the second via hole formed in the cured base substrate with a conductive material;
- wherein the laminating comprises:
- laminating the cured base substrate where the via hole communicating with the second via hole is formed on the rigid region of the flexible board where the second via hole is formed;
- and
- forming an external circuit pattern on one surface of the cured base substrate laminated on the flexible board.
Dependencies are inferred from the claim text.