H05K 2203/0465
Shape of solder
Official title: Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
H05K2203/0465 (Shape of solder) appears on 175 US grants and 153 published applications in this corpus.
Search patents in H05K- Granted patents
- 175
- Published applications
- 153
- Assignees
- 115
- Inventors
- 418
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 7 | 0 |
| 1998 | 4 | 0 |
| 1999 | 12 | 0 |
| 2000 | 8 | 0 |
| 2001 | 11 | 7 |
| 2002 | 6 | 8 |
| 2003 | 15 | 8 |
| 2004 | 4 | 7 |
| 2005 | 8 | 12 |
| 2006 | 5 | 13 |
| 2007 | 6 | 7 |
| 2008 | 7 | 13 |
| 2009 | 4 | 13 |
| 2010 | 5 | 8 |
| 2011 | 5 | 3 |
| 2012 | 10 | 2 |
| 2013 | 1 | 2 |
| 2014 | 4 | 6 |
| 2015 | 2 | 12 |
| 2016 | 5 | 5 |
| 2017 | 7 | 4 |
| 2018 | 6 | 4 |
| 2019 | 8 | 4 |
| 2020 | 3 | 4 |
| 2021 | 1 | 1 |
| 2022 | 5 | 1 |
| 2023 | 1 | 1 |
| 2024 | 0 | 4 |
| 2025 | 1 | 3 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Circuit board, semiconductor device, and method of manufacturing circuit board17 Feb 2026US 12,557,222 B2Shinko Electric Industries Co., Ltd.
- Electronic module, electronic apparatus, and method of manufacturing the electronic module28 Oct 2025US 12,457,688 B2Canon Kabushiki Kaisha
- Printed circuit board assembly and terminal3 Oct 2023US 11,778,744 B2Vivo Mobile Communication Co., Ltd.
- Electronic component mounting substrate and manufacturing method thereof29 Nov 2022US 11,516,923 B2Koito Manufacturing Co., Ltd.
- Optimized system and method for solder ball flattening in printed circuit board manufacturing process10 Sep 2026US 2026/0267321 A1Nan Ya Plastics Corporation
- Method for accommodating substrate warpage in printed circuit board assemblies26 Jun 2025US 2025/0212320 A1Rockwell Collins, Inc.
- Creating a solder barrier by changing a material property of a trace on a printed circuit board8 May 2025US 2025/0151206 A1Sandsik Technologies, Inc.
- Semiconductor package including resin, and electronic device including same20 Mar 2025US 2025/0096186 A1Samsung Electronics Co., Ltd.
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module1 Aug 2024US 2024/0260168 A1Vitesco Technologies GmbH
Most cited
By later US patents
- Method for forming elongated solder connections between a semiconductor device and a supporting substrate304US 4,545,610 AInternational Business Machines Corporation · 1985
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Ball-grid-array integrated circuit package with solder-connected thermal conductor174US 5,642,261 ASGS-Thomson Microelectronics S.A. · 1997
- Ball grid array having reduced mechanical stress109US 5,598,036 AIndustrial Technology Research Institute · 1997
- Chip card equipped with a loop antenna, and associated micromodule108US 6,568,600 B1Bull CP8 · 2003