Creating a solder barrier by changing a material property of a trace on a printed circuit board
AssigneeSandsik Technologies, Inc.
InventorJohn Patrick Burke
Life of this patent
Estimating the term…
Abstract
A printed circuit board (PCB) includes a connection area and a trace extending from the connection area. A solder barrier is provided on at least a portion of the trace. The solder barrier is used in lieu of a solder mask. The solder barrier is formed by a laser oxidation process or a laser ablation process, which alters a material property of the trace. Altering the material property of the trace causes the altered portion of the trace to be non-solderable, but does not negatively impact the speed or reliability of signal transmission along the trace.
Claims20
A printed circuit board (PCB), comprising:
- a connection area for receiving an electronic component;
- a trace extending from the connection area;
- and
- a solder barrier provided on at least one of a portion of the connection area and a portion of the trace, the solder barrier being formed by changing a material property of the at least one of the portion of the connection area and the portion of the trace.
A printed circuit board (PCB), comprising:
- an attachment means provided on a surface of the PCB, the attachment means for receiving an electronic component;
- a signal transmission means extending from the attachment means;
- and
- a solder barrier means provided on at least one of a portion of the attachment means and a portion of the signaling means, the solder barrier means being formed by changing a property of the at least one of the portion of the attachment means and the portion of the signal transmission means.
A method, comprising:
- forming a trace and a solder pad on a top surface of a printed circuit board (PCB);
- and
- forming a solder barrier by altering a material property of a portion of at least one of the trace and the solder pad, the solder barrier being used in lieu of a solder mask on the at least one of the trace and the solder pad.
Dependencies are inferred from the claim text.