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US 11,516,923 B2Granted
Electronic component mounting substrate and manufacturing method thereof
AssigneeKoito Manufacturing Co., Ltd.
InventorsShinya Kusazaki, Hiroki Ishibashi
Life of this patent
Estimating the term…
Abstract
An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.
Claims14
An electronic component mounting substrate comprising:
- a substrate body;
- and
- a plurality of lands provided on the substrate body and configured to connect to a plurality of metal pads of an electronic component, respectively, on a bottom surface of the electronic component,
- wherein at least two of the plurality of lands are electrically connected to corresponding metal pads of the electronic component by bonding using a conductive adhesive, and lands other than the at least two of the plurality of lands are electrically connected to corresponding metal pads of the electronic component by soldering.
1 more element
A method for manufacturing an electronic component mounting substrate, the method comprising:
- supplying a paste solder to a first position of a substrate and supplying a conductive adhesive to a second position of the substrate;
- mounting an electronic component on the substrate so that a bottom surface of the electronic component contacts the substrate at least at the first and second positions of the substrate;
- and
- heating the substrate and the electronic component so that the electronic component and the substrates are electrically connected,
- wherein the electronic component and the substrate are electrically connected at a plurality of places,
- at least two places of the plurality of places are electrically connected by bonding using the conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using the paste solder, and
- the conductive adhesive includes an organic binder having a thermosetting temperature lower than a melting point of the paste solder used in the soldering.
4 more elements
Dependencies are inferred from the claim text.