H05K 2201/10621
Components characterised by their electrical contacts
H05K2201/10621 (Components characterised by their electrical contacts) appears on 8,293 US grants and 7,450 published applications in this corpus.
Search patents in H05K- Granted patents
- 8,293
- Published applications
- 7,450
- Assignees
- 1,805
- Inventors
- 14,104
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 10 | 0 |
| 1978 | 15 | 0 |
| 1979 | 9 | 0 |
| 1980 | 10 | 0 |
| 1981 | 16 | 0 |
| 1982 | 27 | 0 |
| 1983 | 27 | 0 |
| 1984 | 25 | 0 |
| 1985 | 40 | 0 |
| 1986 | 43 | 0 |
| 1987 | 60 | 0 |
| 1988 | 55 | 0 |
| 1989 | 78 | 0 |
| 1990 | 80 | 0 |
| 1991 | 105 | 0 |
| 1992 | 78 | 0 |
| 1993 | 86 | 0 |
| 1994 | 124 | 0 |
| 1995 | 140 | 0 |
| 1996 | 157 | 0 |
| 1997 | 131 | 0 |
| 1998 | 190 | 0 |
| 1999 | 215 | 0 |
| 2000 | 236 | 0 |
| 2001 | 279 | 132 |
| 2002 | 326 | 336 |
| 2003 | 306 | 328 |
| 2004 | 277 | 379 |
| 2005 | 250 | 413 |
| 2006 | 283 | 465 |
| 2007 | 305 | 507 |
| 2008 | 295 | 575 |
| 2009 | 287 | 555 |
| 2010 | 381 | 442 |
| 2011 | 376 | 293 |
| 2012 | 340 | 214 |
| 2013 | 261 | 175 |
| 2014 | 199 | 265 |
| 2015 | 197 | 276 |
| 2016 | 201 | 246 |
| 2017 | 248 | 203 |
| 2018 | 210 | 220 |
| 2019 | 223 | 220 |
| 2020 | 236 | 235 |
| 2021 | 180 | 185 |
| 2022 | 157 | 178 |
| 2023 | 152 | 194 |
| 2024 | 137 | 166 |
| 2025 | 138 | 123 |
| 2026 | 85 | 125 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/10734Ball grid array [bga]Indexing code2,303
- H05K 2201/10674Flip chipIndexing code2,014
- H05K 2201/10636Leadless chipIndexing code1,455
- H05K 2201/10689Leaded integrated circuit [ic] packageIndexing code1,405
- H05K 2201/10681Tape carrier package [tcp]Indexing code455
- H05K 2201/10727Leadless chip carrier [lcc]Indexing code415
- H05K 2201/10719Land grid array [lga]Indexing code391
- H05K 2201/10704Pin grid array [pga]Indexing code268
All 15 subgroupsShow fewer
- H05K 2201/10651Component having two leadsIndexing code260
- H05K 2201/10666Plated through-hole for surface mounting on pcbIndexing code192
- H05K 2201/10659Different types of terminals for the same componentIndexing code152
- H05K 2201/10628Leaded surface mounted deviceIndexing code100
- H05K 2201/10643Disc shaped leadless componentIndexing code67
- H05K 2201/10696Single-in-line [sil] packageIndexing code62
- H05K 2201/10712Via grid arrayIndexing code45
Recent patents
- Transmitter charging module for light detection and ranging (lidar) device22 Sep 2026US 12,745,350 B2Waymo LLC
- Power amplifier modules and systems containing electromagnetic bandgap isolation arrays25 Aug 2026US 12,720,668 B2NXP USA, Inc.
- Sense resistor25 Aug 2026US 12,720,681 B2Analog Devices International Unlimited Company
- Efficient assembly for electrolytic capacitors on solid state drives25 Aug 2026US 12,720,682 B2SanDisk Technologies LLC
- Methods related to dual-sided radio-frequency package with overmold structure25 Aug 2026US 12,721,179 B2Skyworks Solutions, Inc.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Electronic device including thermal interface material1 Oct 2026US 2026/0304593 A1Samsung Electronics Co., Ltd.
- Component Carrier With at Least One Opening and Method of Manufacturing a Component Carrier1 Oct 2026US 2026/0304618 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
Most cited
By later US patents
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990
- Oximeter sensor assembly with integral cable and encoder1,015US 5,069,213 AThor Technology Corporation · 1991
- Oximeter sensor assembly with integral cable and method of forming the same965US 5,041,187 AThor Technology Corporation · 1991
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991