H05K 2201/10628
Leaded surface mounted device
H05K2201/10628 (Leaded surface mounted device) appears on 100 US grants and 116 published applications in this corpus.
Search patents in H05K- Granted patents
- 100
- Published applications
- 116
- Assignees
- 95
- Inventors
- 294
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 2 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 3 |
| 2007 | 3 | 2 |
| 2008 | 0 | 2 |
| 2009 | 1 | 5 |
| 2010 | 2 | 2 |
| 2011 | 2 | 1 |
| 2012 | 1 | 5 |
| 2013 | 3 | 1 |
| 2014 | 3 | 1 |
| 2015 | 0 | 6 |
| 2016 | 2 | 7 |
| 2017 | 8 | 14 |
| 2018 | 8 | 10 |
| 2019 | 11 | 6 |
| 2020 | 7 | 9 |
| 2021 | 9 | 5 |
| 2022 | 3 | 7 |
| 2023 | 3 | 9 |
| 2024 | 8 | 4 |
| 2025 | 7 | 4 |
| 2026 | 4 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Stepped package and recessed circuit board7 Jul 2026US 12,677,375 B2Intel Corporation
- Three-wire flat cable high-voltage plug-in light string and method of making thereof5 May 2026US 12,618,533 B2Dongguan Yongfeng Lighting Co., Ltd Dongguan City
- High capacitance module10 Feb 2026US 12,550,265 B2Innodisk Corporation
- High performance interposer and chip socket having contacts with an outer bean and an inner beam13 Jan 2026US 12,525,735 B2Amphenol Corporation
- Snap fit bracket for electrolytic capacitors19 Aug 2025US 12,394,566 B2SanDisk Technologies LLC
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Three-wire flat cable high-voltage plug-in light string and method of making thereof30 Apr 2026US 2026/0117940 A1Dongguan Yongfeng Lighting Co., Ltd
- Information processing apparatus, information processing system, writing jig, and writing method30 Apr 2026US 2026/0119443 A1Lenovo (Singapore) Pte. Ltd.
- Waterproof light-emitting diode plug-in light and method of making thereof23 Apr 2026US 2026/0110408 A1Dongguan Yongfeng Lighting Co., Ltd
- Vehicle circuit board2 Apr 2026US 2026/0096011 A1Autonetworks Technologies, Ltd.
Most cited
By later US patents
- LED mounting system117US 6,582,100 B1Relume Corporation · 2003
- LED unit with interlocking legs62US 7,832,897 B2Foxconn Technology Co., Ltd. · 2010
- Method and apparatus for bonding components leads to pads located on a non-rigid substrate44US 4,970,365 AInternational Business Machines Corporation · 1990
- Adhesive component means for attaching electrical components to conductors39US 4,818,823 AMicro-Circuits Company · 1989
- Method of manufacturing an inductance element34US 4,860,433 ASanyo Electric Co., Ltd. · 1989