H05K 2201/10613
Details of electrical connections of non-printed components
Official title: Details of electrical connections of non-printed components, e.g. special leads
H05K2201/10613 (Details of electrical connections of non-printed components) appears on 10,639 US grants and 9,643 published applications in this corpus.
Search patents in H05K- Granted patents
- 10,639
- Published applications
- 9,643
- Assignees
- 2,368
- Inventors
- 18,278
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 19 | 0 |
| 1977 | 22 | 0 |
| 1978 | 23 | 0 |
| 1979 | 19 | 0 |
| 1980 | 21 | 0 |
| 1981 | 26 | 0 |
| 1982 | 33 | 0 |
| 1983 | 38 | 0 |
| 1984 | 34 | 0 |
| 1985 | 56 | 0 |
| 1986 | 63 | 0 |
| 1987 | 83 | 0 |
| 1988 | 82 | 0 |
| 1989 | 103 | 0 |
| 1990 | 97 | 0 |
| 1991 | 151 | 0 |
| 1992 | 115 | 0 |
| 1993 | 107 | 0 |
| 1994 | 157 | 0 |
| 1995 | 174 | 0 |
| 1996 | 185 | 0 |
| 1997 | 166 | 0 |
| 1998 | 241 | 0 |
| 1999 | 264 | 0 |
| 2000 | 292 | 0 |
| 2001 | 356 | 168 |
| 2002 | 399 | 408 |
| 2003 | 364 | 400 |
| 2004 | 338 | 453 |
| 2005 | 308 | 520 |
| 2006 | 347 | 559 |
| 2007 | 380 | 631 |
| 2008 | 352 | 682 |
| 2009 | 359 | 674 |
| 2010 | 458 | 537 |
| 2011 | 451 | 378 |
| 2012 | 419 | 294 |
| 2013 | 318 | 249 |
| 2014 | 259 | 357 |
| 2015 | 267 | 370 |
| 2016 | 285 | 319 |
| 2017 | 328 | 261 |
| 2018 | 278 | 292 |
| 2019 | 293 | 283 |
| 2020 | 306 | 302 |
| 2021 | 225 | 269 |
| 2022 | 213 | 249 |
| 2023 | 218 | 276 |
| 2024 | 204 | 266 |
| 2025 | 210 | 179 |
| 2026 | 133 | 267 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Interconnexion film and electronic structure comprising such a film29 Sep 2026US 12,750,952 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Transmitter charging module for light detection and ranging (lidar) device22 Sep 2026US 12,745,350 B2Waymo LLC
- Electrical equipment22 Sep 2026US 12,745,351 B2Valeo Electrification
- Illuminated signage and badges15 Sep 2026US 12,739,970 B2CoreLED Systems, LLC
- Spring bracket and sensor device including same8 Sep 2026US 12,733,102 B2Johnson Controls Fire Protection LP
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Electronic device including thermal interface material1 Oct 2026US 2026/0304593 A1Samsung Electronics Co., Ltd.
- Component Carrier With at Least One Opening and Method of Manufacturing a Component Carrier1 Oct 2026US 2026/0304618 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
Most cited
By later US patents
- Oximeter sensor assembly with integral cable1,236US 4,964,408 AThor Technology Corporation · 1990
- Oximeter sensor assembly with integral cable and encoder1,015US 5,069,213 AThor Technology Corporation · 1991
- Oximeter sensor assembly with integral cable and method of forming the same965US 5,041,187 AThor Technology Corporation · 1991
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991