H05K 2201/10954
Other details of electrical connections
H05K2201/10954 (Other details of electrical connections) appears on 2,310 US grants and 1,976 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,310
- Published applications
- 1,976
- Assignees
- 857
- Inventors
- 4,877
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 5 | 0 |
| 1978 | 6 | 0 |
| 1979 | 8 | 0 |
| 1980 | 6 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 10 | 0 |
| 1984 | 8 | 0 |
| 1985 | 15 | 0 |
| 1986 | 23 | 0 |
| 1987 | 23 | 0 |
| 1988 | 31 | 0 |
| 1989 | 20 | 0 |
| 1990 | 20 | 0 |
| 1991 | 31 | 0 |
| 1992 | 29 | 0 |
| 1993 | 23 | 0 |
| 1994 | 44 | 0 |
| 1995 | 44 | 0 |
| 1996 | 41 | 0 |
| 1997 | 43 | 0 |
| 1998 | 72 | 0 |
| 1999 | 58 | 0 |
| 2000 | 72 | 0 |
| 2001 | 96 | 33 |
| 2002 | 80 | 79 |
| 2003 | 69 | 83 |
| 2004 | 69 | 84 |
| 2005 | 63 | 93 |
| 2006 | 64 | 109 |
| 2007 | 69 | 129 |
| 2008 | 55 | 118 |
| 2009 | 70 | 126 |
| 2010 | 76 | 112 |
| 2011 | 91 | 86 |
| 2012 | 91 | 66 |
| 2013 | 65 | 68 |
| 2014 | 59 | 83 |
| 2015 | 66 | 87 |
| 2016 | 73 | 69 |
| 2017 | 67 | 51 |
| 2018 | 66 | 60 |
| 2019 | 56 | 47 |
| 2020 | 54 | 52 |
| 2021 | 40 | 42 |
| 2022 | 34 | 59 |
| 2023 | 36 | 71 |
| 2024 | 51 | 86 |
| 2025 | 64 | 40 |
| 2026 | 37 | 43 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/10977Encapsulated connectionsIndexing code1,007
- H05K 2201/10984Component carrying a connection agentIndexing code424
- H05K 2201/10969Metallic case or integral heatsink of component electrically connected to a padIndexing code393
- H05K 2201/10992Using different connection materialsIndexing code302
- H05K 2201/10962Component not directly connected to the pcbIndexing code272
Recent patents
- Interconnexion film and electronic structure comprising such a film29 Sep 2026US 12,750,952 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Electrical equipment22 Sep 2026US 12,745,351 B2Valeo Electrification
- Illuminated signage and badges15 Sep 2026US 12,739,970 B2CoreLED Systems, LLC
- Spring bracket and sensor device including same8 Sep 2026US 12,733,102 B2Johnson Controls Fire Protection LP
- Micro circuit structure and manufacturing method thereof1 Sep 2026US 12,727,077 B2Kinsus Interconnect Technology Corp.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Lead electro-etching before plating to mitigate burr1 Oct 2026US 2026/0304630 A1
- Adhesive agent composition, adhesive agent film for circuit connection, circuit connection structure, and method for manufacturing same24 Sep 2026US 2026/0293741 A1
- Circuit module, circuit board, electronic device, and package module10 Sep 2026US 2026/0271181 A1Lite-On Technology Corporation
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
Most cited
By later US patents
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making339US 4,604,644 AInternational Business Machines Corporation · 1986
- Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices266US 6,326,698 B1Micron Technology, Inc. · 2001
- Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders244US 5,203,075 AInernational Business Machines Corporation · 1993
- Structure for semiconductor package for improving the efficiency of spreading heat241US 5,903,052 AIndustrial Technology Research Institute · 1999