H05K 2201/10969
Metallic case or integral heatsink of component electrically connected to a pad
Official title: Metallic case or integral heatsink of component electrically connected to a pad on PCB
H05K2201/10969 (Metallic case or integral heatsink of component electrically connected to a pad) appears on 393 US grants and 289 published applications in this corpus.
Search patents in H05K- Granted patents
- 393
- Published applications
- 289
- Assignees
- 260
- Inventors
- 941
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 6 | 0 |
| 1987 | 3 | 0 |
| 1988 | 8 | 0 |
| 1989 | 3 | 0 |
| 1990 | 8 | 0 |
| 1991 | 11 | 0 |
| 1992 | 6 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 11 | 0 |
| 1996 | 13 | 0 |
| 1997 | 11 | 0 |
| 1998 | 17 | 0 |
| 1999 | 15 | 0 |
| 2000 | 14 | 0 |
| 2001 | 20 | 4 |
| 2002 | 13 | 6 |
| 2003 | 5 | 15 |
| 2004 | 14 | 7 |
| 2005 | 7 | 11 |
| 2006 | 9 | 17 |
| 2007 | 13 | 29 |
| 2008 | 11 | 19 |
| 2009 | 11 | 25 |
| 2010 | 7 | 19 |
| 2011 | 13 | 15 |
| 2012 | 24 | 10 |
| 2013 | 10 | 18 |
| 2014 | 14 | 14 |
| 2015 | 8 | 10 |
| 2016 | 12 | 12 |
| 2017 | 10 | 4 |
| 2018 | 2 | 4 |
| 2019 | 6 | 4 |
| 2020 | 4 | 5 |
| 2021 | 4 | 1 |
| 2022 | 1 | 8 |
| 2023 | 2 | 11 |
| 2024 | 10 | 12 |
| 2025 | 6 | 3 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Semiconductor package4 Aug 2026US 12,702,026 B2LG Innotek Co., Ltd.
- Electronic assembly9 Jun 2026US 12,652,782 B2Valeo Comfort and Driving Assistance
- Solid state power switch assembly of an aircraft solid state power controller and method of providing a solid state power switch assembly for an aircraft solid state power controller2 Jun 2026US 12,646,907 B2Hs Elektronik Systeme GmbH
- Circuit board, an image sensor module, a lens driving device, and a camera module including the same10 Feb 2026US 12,549,838 B2LG Innotek Co., Ltd.
- Circuit board6 Aug 2026US 2026/0231325 A1
- Heat dissipation structure for semiconductor package module and electronic device including the same23 Jul 2026US 2026/0215275 A1Unick Corporation
- Power modules with enhanced thermal conductivity11 Jun 2026US 2026/0164537 A1Analog Devices, Inc.
- Circuit board, an image sensor module, a lens driving device, and a camera module including the same21 May 2026US 2026/0143217 A1LG Innotek Co., Ltd.
- Printed circuit board assembly26 Feb 2026US 2026/0059647 A1Rolls-Royce Deutschland Ltd & Co KG
Most cited
By later US patents
- Semiconductor device having dual electrical contact sites344US 5,157,480 AMotorola, Inc. · 1992
- Structure for semiconductor package for improving the efficiency of spreading heat241US 5,903,052 AIndustrial Technology Research Institute · 1999
- Surface mount semiconductor package197US 6,204,554 B1International Rectifier Corporation · 2001
- Ball-grid-array integrated circuit package with solder-connected thermal conductor174US 5,642,261 ASGS-Thomson Microelectronics S.A. · 1997
- Strip line circuit component and method of manufacture170US 4,821,007 ATektronix, Inc. · 1989