H05K 2201/10992
Using different connection materials
Official title: Using different connection materials, e.g. different solders, for the same connection
H05K2201/10992 (Using different connection materials) appears on 302 US grants and 171 published applications in this corpus.
Search patents in H05K- Granted patents
- 302
- Published applications
- 171
- Assignees
- 121
- Inventors
- 655
- Latest grant
- 17 Sep 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 10 | 0 |
| 1995 | 10 | 0 |
| 1996 | 9 | 0 |
| 1997 | 9 | 0 |
| 1998 | 25 | 0 |
| 1999 | 23 | 0 |
| 2000 | 31 | 0 |
| 2001 | 35 | 12 |
| 2002 | 21 | 25 |
| 2003 | 17 | 16 |
| 2004 | 14 | 16 |
| 2005 | 9 | 12 |
| 2006 | 9 | 11 |
| 2007 | 10 | 16 |
| 2008 | 4 | 9 |
| 2009 | 6 | 6 |
| 2010 | 5 | 10 |
| 2011 | 6 | 3 |
| 2012 | 1 | 6 |
| 2013 | 4 | 1 |
| 2014 | 0 | 0 |
| 2015 | 3 | 9 |
| 2016 | 4 | 3 |
| 2017 | 4 | 2 |
| 2018 | 2 | 0 |
| 2019 | 1 | 3 |
| 2020 | 3 | 1 |
| 2021 | 2 | 1 |
| 2022 | 2 | 3 |
| 2023 | 1 | 0 |
| 2024 | 2 | 4 |
| 2025 | 0 | 0 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Leadframe package with pre-applied filler material17 Sep 2024US 12,094,725 B2STMicroelectronics S.r.l.
- Pre-plating of solder layer on solderable elements for diffusion soldering20 Aug 2024US 12,069,802 B2Infineon Technologies AG
- Chip assemblies31 Oct 2023US 11,805,602 B2Intel Corporation
- Connecting electronic components to mounting substrates11 Oct 2022US 11,470,726 B2Murata Manufacturing Co., Ltd.
- Leadframe package with pre-applied filler material18 Jan 2022US 11,227,776 B2STMicroelectronics S.r.l.
- Electronic package and method for forming the same28 May 2026US 2026/0150199 A1JCET STATS ChipPAC Korea Limited
- Method for mounting an electronic component in a printed circuit board, method for producing a multilayer printed circuit board and printed circuit board obtained by this method22 Jan 2026US 2026/0025931 A1
- Materials for semiconductor package mount applications and methods of using the same21 Nov 2024US 2024/0389240 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering7 Nov 2024US 2024/0373548 A1Infineon Technologies AG
- Interconnect substrate, method of making the same, and semiconductor apparatus11 Jul 2024US 2024/0234278 A9Shinko Electric Industries Co., Ltd.
Most cited
By later US patents
- Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders244US 5,203,075 AInernational Business Machines Corporation · 1993
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Surface mount solder assembly of leadless integrated circuit packages to substrates197US 5,346,118 AAT&T Bell Laboratories · 1994
- Solder ball connect pad-on-via assembly process181US 5,275,330 AInternational Business Machines Corporation · 1994
- Method of making components with solder balls162US 6,165,885 AInternational Business Machines Corporation · 2000