Chip assemblies
AssigneeIntel Corporation
InventorsLoke Yip Foo, Choong Kooi Chee, Teong Guan Yew
Life of this patent
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Abstract
A chip assembly may include a package substrate that includes one or more pins. The chip assembly may also include one or more pads. The one or more pads may be electrically coupled to the one or more pins. In addition, the chip assembly may include a board that includes one or more board pads. Further, the chip assembly may include an anisotropic layer. The anisotropic layer may be positioned between the board and the one or more pads and between the board and a portion of the package substrate. In addition, the anisotropic layer may mechanically couple the board to the one or more pads and to the portion of the package substrate. Further, the anisotropic layer may electrically couple the one or more pads to the one or more board pads.
Claims20
A chip assembly, comprising:
- a package substrate comprising one or more pins;
- one or more pads, the one or more pads electrically coupled to the one or more pins;
- a board comprising one or more board pads;
- and
- an anisotropic layer positioned between the board and the one or more pads and between the board and a portion of the package substrate, the anisotropic layer mechanically coupling the board to the one or more pads and to the portion of the package substrate and electrically coupling the one or more pads to the one or more board pads.
A chip assembly, comprising:
- a package substrate comprising a plurality of pins, the package substrate configured to provide one or more signals via the plurality of pins according to a first pinout;
- a first plurality of pads electrically coupled to the plurality of pins;
- a bridge device comprising a plurality of device vias;
- a second plurality of pads, the second plurality of pads electrically coupled to first ends of the plurality of device vias;
- and
- an anisotropic layer positioned between a portion of the bridge device and a portion of the package substrate and between the first plurality of pads and the second plurality of pads, wherein:
- the anisotropic layer mechanically couples the portion of the bridge device to the portion of the package substrate and the first plurality of pads to the second plurality of pads;
- the anisotropic layer electrically couples the first plurality of pads to the second plurality of pads;
- and
- the bridge device is configured provide the one or more signals via second ends of the plurality of device vias according to a second pinout that is different than the first pinout.
A method comprising:
- forming a board comprising a first surface that comprises one or more board pads;
- placing an anisotropic material on at least a portion of the first surface of the board;
- forming a package substrate comprising a first surface that comprises one or more pins;
- attaching one or more pads to the first surface of the package substrate relative to the one or more pins;
- positioning the package substrate and the one or more pads relative to the board such that the anisotropic material is between the board and the one or more pads and between the board and a portion of the package substrate;
- and
- curing the anisotropic material such that the board is mechanically coupled to the one or more pads and mechanically coupled to the portion of the package substrate and such that the one or more pads are electrically coupled to the one or more board pads.
Dependencies are inferred from the claim text.