Method for mounting an electronic component in a printed circuit board, method for producing a multilayer printed circuit board and printed circuit board obtained by this method

A method for manufacturing a multilayer printed circuit board, comprising:

• a) assembling at least one first electronic component to an inner conductive layer of a printed circuit board, said assembling including the following operations of:
• 1) depositing a solder paste onto the conductive layer, said solder paste including tin, copper balls and a soldering flux,
• 2) positioning the electronic component on the solder paste, and then
• 3) soldering by diffusion said electronic component.
• b) depositing a dielectric layer onto the first electronic component and the inner conductive layer;
• and
• c) assembling at least one second electronic component to an outer conductive layer of the printed circuit board, said assembling of the second electronic component including the following operations of:
• i. depositing a solder bead onto an outer conductive layer,
• ii. positioning the second electronic component on the solder bead, and
• iii. softly soldering the second electronic component, characterised in that the solder bead comprises a tin-based alloy, distinct from the solder paste.