Connecting electronic components to mounting substrates

A method of connecting an electronic component on a mounting substrate, the method comprising:

• arranging the electronic component on the mounting substrate with a first surface of the electronic component facing the mounting substrate and a second surface of the electronic component facing away from the mounting substrate, the first and second surfaces of the electronic component being opposite to each other, and the electronic component having a first component-side conductor on the second surface and a second component-side conductor;
• electrically connecting the second component-side conductor of the electronic component to a second substrate-side conductor on the mounting substrate;
• applying an electrically-insulating paste to the second component-side conductor so as to shield the second component-side conductor from the first component-side conductor;
• after applying the electrically-insulating paste, electrically connecting the first component-side conductor on the second surface of the electronic component to a first substrate-side conductor on the mounting substrate by applying electrically-conductive adhesive in the form of electrically-conductive paste between the first component-side conductor and the first substrate-side conductor;
• and
• solidifying the electrically-conductive paste by a heating process;
• wherein the step of electrically connecting the first component-side conductor comprises using a common portion of the electrically-conductive adhesive, spanning across the electronic component on the side thereof remote from the mounting substrate and across the electrically-insulating paste, to electrically connect the first component-side conductor to the first substrate-side conductor and shield the second component-side conductor from the electrically-conductive paste.