Interconnexion film and electronic structure comprising such a film

A method for manufacturing an interconnexion film that includes a base layer formed of an electrically insulating polymeric material and comprising a first face and a second face opposite to the first face;

• a plurality of first patterns projecting from the first face, the first patterns being formed of the electrically insulating polymeric material and configured so that the interconnexion film constitutes a dry adhesive film;
• a metal element comprising:
• a body which extends through the base layer from the first face to the second face;
• and as an extension of the body, at least one second pattern projecting from the first face;
• wherein the metal element is made of solid metal and wherein said at least one second pattern of the metal element has a shape different from that of the first patterns and, in a plane parallel to the first face, a constant or decreasing cross-section away from the first face,
• the method comprising:
• providing a mould comprising first cavities and a second cavity, the first cavities and the second cavity extending from an external face of the mould, the second cavity having a shape different from that of the first cavities and, in a plane parallel to the external face, a constant or decreasing cross-section away from the external face;
• forming the metal element in a region of the mould comprising the second cavity, the metal element comprising the body disposed on the external face of the mould and, as an extension of the body, a projecting pattern disposed inside the second cavity;
• depositing the electrically insulating polymeric material in the first cavities and onto the external face of the mould, so as to form a polymer film which embeds the body of the metal element, and
• unmoulding the polymer film and the metal element.