Micro circuit structure and manufacturing method thereof

Abstract

A micro circuit structure includes a circuit substrate, a circuit pattern layer, and a fixed layer. A first surface of the circuit substrate has a plurality of recessed portions. The circuit pattern layer is formed on the first surface of the circuit substrate. The circuit pattern layer includes a plurality of circuit patterns, a gap between the circuit patterns is less than 10 μm, and each of the circuit patterns is located between two recessed portions. The fixed layer is formed on the first surface of the circuit substrate and between the circuit patterns, where a second surface of the circuit pattern is exposed to a third surface of the fixed layer. By arranging the recessed portions between the circuit patterns, residual metal substances can be removed to avoid a short circuit caused by conduction, and a problem of electron-migration.

Dependencies are inferred from the claim text.